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Adhesives Division

Microelectronics Equipment Division

Materials Division

ISO 9001:2000 Accredited
 

Welcome To Inseto's Website

'Suppliers of Equipment and Materials for Industry'

Inseto, founded in 1987, provide advanced manufacturing equipment, assembly materials and related consumable products for electronic production, including Semiconductor, Micro & Nonoelectronic Assembly, as well as products for general industrial manufacturing.

Inseto's range of products are available from specialist technology divisions, which offer carefully selected, technically innovative, high performance products including:

Adhesives Division: Inseto provide high technology adhesives from DELO, including UV cured adhesives, light curing epoxies & light cure acrylics, cyanoacrylates adhesives, structural polyurethanes, anaerobic adhesives, one & two part epoxies plus dispensing systems and UV curing lamps.

Microelectronic Equipment Division: Inseto's division that provides equipment used in the production of microelectronic devices from wafer inspection systems, through wafer mounting equipment, component dicing saws, die bonders, die sorting systems, manual to automatic wire bonders, wire bond pull and shear testers, Xray inspection machines to mixed signal test equipment.

Microelectronic Materials Division: For assembly materials and machine consumable used in semiconductor, photonic and hybrid assembly industries. Products include dicing blades, bonding tools and capillaries, bonding wires & ribbons, precision stampings, preforms, hermetic glass & ceramic packages, thick film materials & metalised thin film.

 

Inseto (UK) Ltd

Company News

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May 2009

Inseto Secures Wire Bonding

Equipment Order From

Dynex Semiconductor

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November 2008

Inseto Welcomes The

Addition Of John Govier

To The Team!

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September 2008

Appoint  Inseto As Their New

Distributor For The UK & Ireland

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