Inseto, founded in 1987, provide advanced manufacturing equipment, assembly materials and related consumable products for electronic production, including Semiconductor, PCB & Microelectronic Assembly, as well as products for general industrial manufacturing.

Inseto's range of products are available from specialist technology divisions, which offer carefully selected, technically innovative, high performance products including:

Adhesives Division: Inseto provide high technology adhesives from DELO, including UV cured adhesives, light curing epoxies & light cure acrylics, cyanoacrylates adhesives, structural polyurethanes, anaerobic adhesives, one & two part epoxies plus dispensing systems and UV curing lamps.

Microelectronic Equipment Division: Inseto's division that provides equipment used in the production of microelectronic devices from wafer inspection systems, through die bonders, die sorting / pick and place systems, manual to automatic wire bonders, wire bond pull and shear testers, to mixed signal test equipment.

Microelectronic Materials Division: For assembly materials and machine consumable used in semiconductor, photonic and hybrid assembly industries. Products include bonding wires & ribbons, precision stampings, preforms, hermetic glass & ceramic packages, thick film materials, metalised thin film and DBC ceramics.

PCB Assembly Products Division: Equipment and materials for surface mount and through hole, printed circuit assembly. Products include component cleaning systems, solder pastes & other soldering materials, solder reflow systems, curing ovens, automatic optical inspection systems, X-ray inspection systems.

Inseto (UK) Ltd

Company News

Thursday August 28 2008

July 2008

TPT Introduce The HB16D

The First Inter-Changeable

Die & Wire Bond System!

June 2008

Dage Bond Testers

Now Distributed In The UK

& Ireland By Inseto

April 2008

Amadyne Introduce

Automatic Bonding System

For Microelectronic Assembly

Accredited To

BS EN ISO 9001:2000