Light Activated Epoxies DELO-KATIOBOND

DELO-KATIOBOND UV curing (320-400nm) & light activated (400-550nm) epoxy adhesives are one part solvent free epoxies suitable for bonding, sealing and potting applications.

Katiobond uv cure /  light cure epoxy adhesives can be used in opaque applications, as once the material has been activated, curing starts due to the decomposition of the photoinitiator and continues to completion. The curing is by cationic polymerisation, hence the product name Katiobond.

The range has good temperature resistance, up to 250 degrees C and excellent chemical resistance, making them ideal for automotive and harsh environment use. The epoxies are dry to touch after cure (no oxygen inhibition occurs). Cured products exhibit low shrinkage, resulting in low stress on delicate devices. Low water absorption and very low ionic content make them ideal for electronic applications.

The cationic curing epoxies are available in variable viscosities from 1,200 to 48,000 mPa.S, with cure of thick layers possible, due to use of visible light which is able to penetrate deeper layers than UVA curing materials.

Selection Chart		Delo-KATIOBOND Selection Chart (48Kb)
Product	Viscosity	Description	Datasheet
4552	1200	Light activated epoxy, brown/clear, excellent flow, tough bond, fast curing	205Kb
KB554	1500	Light activated epoxy, yellow/fluorescent, good flow, elastic, tension equalising	201Kb
4557	3500	Light activated epoxy, brown/clear, toughened grade with good flow properties	196Kb
4578	12,400 Thix	Light activated epoxy, brown/milky, medium viscosity, fast curing with tough bond	188Kb
4594	32,000 Thix	Light activated epoxy, brown/milky, good for gap filling, tough bond, fast cure	204Kb
45952	32,000 Thix	Light activated epoxy, brown/milky, fluorescent trace, tough elastic	189Kb
4597	48,000 Thix	Light activated epoxy, brown/milky, gap filling, toughened grade	197Kb
4670	4800	UV curing epoxy, good flow properties	210Kb
4696	180,000 Thix	UV curing epoxy, high stability, low water absorption, v-low ion content, for dams	204Kb
Applications & Uses		Bonding Sealing Encapsulation
Industry Segments:		Communications electronics Consumer electronics Automotive electronics Plastic and glass processing
Technical Advice		enquiries@inseto.co.uk
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