KULICKE & SOFFA (K&S) MANUAL WIRE BONDERS

K&S Manual Wire Bonding Systems for process development, production or research, provide excellent ease of use, optimum bond quality and repeatability, plus the reliability needed for the most challenging bonding applications.

Kulicke & Soffa Ultrasonic Wire bonders are available with Semi-automatic and manual operation modes, individual bond parameter control and capacity for a wide range of wire diameters enable ease of use in gold ball bonding, ball bumping, coining, security bonding, single-point TAB, thermosonic, aluminium or gold wedge and ribbon bonding applications.

Product range overview

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K&S 4526 Manual Wedge Bonder
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The 4526 K&S manual wedge bonder is simple to set-up and for ease of use incorporates analog controls, which allow rapid adjustment of individual bonding parameters. The system is capable of ultrasonically bonding a wide range of gold / aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250micron ribbon.

 

A motorised Y axis with auto-stepback provides controlled wire length and repeatable loop formation. In addition, the system has a large working area and table motion, with excellent Z axis clearance, for bonding small through large devices.

K&S 4522 Analog Gold Ball Wire Bonder For Bonding Gold or Copper Wires
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The 4522 is an advanced bench-top manual gold ball wire bonder with operator initiated controls and analog adjustments, which allow rapid adjustment of individual bonding parameters. The system is capable of ultrasonically bonding gold wires from 18 - 75 micron.

 

The system features a large bonding area up to 6 x 6", consistent ball size control via negative EFO, missing ball detection with auto-stop and advanced loop controls. A copper conversion kit is also available.

iBond5000 Convertible Ball and Wedge Bonder
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The iBond5000Wedge is the latest generation of manual wedge bonder from market leader Kulicke & Soffa, for ultrasonic fine wire bonding using Wedge, Stitch or Ribbon processes with aluminium, gold or copper bonding wires.

The equipment's mechanical design is based on the proven 4500 series, resulting in excellent yield and repeatability required for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-boards, Leads, Sensors and High Power Devices.

iBond5000 Convertible Ball and Wedge Bonder
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The iBond5000Ball is an advanced manual wire bonder for gold ball bonding (copper optional) used throughout research & development laboratories, Universities, engineering and production facilities.

Designed to produce repeatable, high-quality wire bonds on a wide range of materials and products, the system features advanced electronics, Windows CE control software and a modern touch-screen user interface.

iBond5000 Convertible Ball and Wedge Bonder
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The iBond5000Dual enables fine aluminium and gold wire wedge or ribbon bonding utilising a deep access wire feed system. For gold or copper ball bonding, the system features a unique Patented N-EFO to generate the ball bond, which is mounted on a unique swing arm assembly, providing simplified changeover between bonding modes.

An internal bonding profiles library, which includes a bonding wires database, further enhances the ease of use and caters for various applications.

Refurbished Wire Bonders From K&S Manual 2nd User Wire Bonding Equipment

Refurbished K&S Wire Bonders

Fully refurbished 2nd user Kulicke and Soffa manual ultrasonic gold ball and wedge wire bonding equipment. Refurbished models include 41xx & 45xx Series, carry up to six months Parts & Labour warranty and are fully overhauled by K&S trained engineers using genuine OEM parts. Contact us for further information and available models.

FURTHER INFORMATION ON KULICKE & SOFFA MANUAL WIRE BONDING EQUIPMENT

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

K&S Website

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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