Adhesives Division
A comprehensive range of technical adhesives for: automotive, electronic, telecommunications, engineering and general manufacturing industries.
Microelectronics Equipment Division
Provides assembly, test & inspection equipment for the microelectronic, photonic and semiconductor industries.
Microelectronics Materials Division
Provides assembly materials and machine consumables for the semiconductor, photonic and hybrid assembly industries.
PCB Assembly Equipment Division
Provides equipment and materials for surface mount and through hole, printed circuit board assembly.
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NEWS, Press-Releases, Web-Updates & Events
Further information about our Company, website and and events.
Inseto Press-Releases
Inseto Press Release - ADT Dicing Equipment & Blade Manufacturer Appoints Inseto As Their New Distributor
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Inseto Press Release - DAGE Bond Testing Equipment Distributed By Inseto
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June 3-5
SMT Hybrid Packaging
June 10-11
IMAPS-UK Micro Tech 2008 - See Inseto At This Event
May 5-7
http://www.photonex.org/