Inseto
Dicing Saws, Scribes & Blades By Advanced Dicing Technologies Ltd
Advanced Dicing Technologies Ltd. (ADT) is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of Silicon-based Semiconductor Wafers and hard materials including Glass, Ceramics, Ferrites, MEMS and in package singulation.
ADT offers dicing equipment and accessories, with a variety of capabilities and levels of automation to suit an ever-growing range of customer requirements. Combining dicing equipment and annular dicing blades, they bring their customers a complete range of dicing solutions.
ADT also manufacture a wide selection of annular dicing blades for your most challenging applications. Their blade selection is comprised of three product families distinguished by the type of binder: Resin-bond Blades, Nickel-bond Blades and Metal-bond (Sintered) Blades.
Product range overview (click image below for more detailed information):
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7100 Series
Semi-automatic Dicing Saws - With four different
models to choose from, each optimized for a specific range of
applications, the 7100 Series covers the full spectrum of dicing
materials from IC wafers to package singulation and hard material
application. The 7100 Series offers the lowest possible cost
-of- ownership while providing the most advanced dicing technology.
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7200 Series
Automatic Dicing Saws - With new architecture and
advanced process control tools, the 7200 models deliver substantially
higher productivity compared to existing dicing systems, while
minimizing the cost of operation. The system offers a wide range
of advanced automation and process monitoring options to meet
the requirements of your most challenging dicing applications.
The 7200 sereies is available in configurations for dicing /
scribing up to 300mm (12") wafers / substrates. |
 |
7900 Series
Dual Spindle Automatic Dicing Saws - The New Dual
Spindle System for LED's & Discrete Devices provides increased
productivity and lower cost of ownership in a minimal machine
footprint. |
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8000 NextStep
Series Laser Scribing System - The NextStep System
of the laser 8000 Series removes only non-silicon elements from
the streets leaving the silicon wafer bare and virtually unaffected.
The wafer can then be diced using a standard mechanical dicing
process. |
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Peripheral
Dicing Equipment - ADT offer a broad range of peripheral
equipment to complement their Dicing Saws including: Wafer Mounting
Stations, Tape Curing Systems, Wafer Cleaning Stations, Spindle
Coolant Recirculation Systems, In-line DI Water Ionizers, Closed-loop
Filtration Equipment & Wafer Frames & Cassettes. |
 |
Dicing
Blades & Accessories - ADT manufacture a wide
selection of annular dicing blades and flanges. Their blade
selection is comprised of three product families distinguished
by the type of binder: Resin-bond Blades, Nickel-bond Blades
and Metal-bond (Sintered) Blades. |
Further
Information On ADT Dicing & Scribing Equipment: |
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| Applications | Dicing
Semiconductor Wafers and Cutting Hard Materials, Cutting Precision
Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites,
Scribbing & Dicing Ceramic Components, Cutting Glass &
Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly
Industries, Universities Wafer Processing, Passive Component
Manufacturing, Separating Medical Devices, Glass Device Processing |
| Industry Segments | Semiconductor
Production, Military & Aerospace, Telecommunications, Medical
Electronics, Fiber Optics / Photonics, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Passive
Component Manufacturing, Medical Devices, Glass Device Processing |
| Technical Papers | Principles
of Dicing.pdf ( 
479 Kb) |
| Technical Advice | |
| ADT Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
