Inseto
Dicing Blades & Accessories By ADT
ADT manufacture a wide selection of annular dicing blades & accessories for your most challenging applications. Their blade selection is comprised of three product families distinguished by the type of binder: Resin-bond Blades, Nickel-bond Blades and Metal-bond (Sintered) Blades.
The dicing blades are composed of abrasive materials embedded in either resin or metal matrix. Resin-bond Blades are cured under pressure and high temperature, Metal-bond Blades are sintered and Nickel-bond Blades are manufactured using a tightly controlled electroforming process.
Dicing Blade Overview:
Resin-bond
Dicing Blades - Resin as binder allows for blade wear management rendering - Excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass - Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size) - Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness) |
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Nickel
Bonded Dicing Blade - The Nickel binder provides longer blade life and lower wear rate - Ideal for soft material applications such as: PCB, Silicon and BGA - Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size) - Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness) |
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Metal-bond
(Sintered) Blades - Slower wear rate than Resin but faster than Nickel - Best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC and Ferrite - Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size) - Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness) |
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933Kb |
Flanges
& Accessories Available for all blade types in the range of 2”- 5”. ADT’s extensive line of flanges exhibits high-accuracy, excellent performance, ease-of-use and affordability, including:. - 2"-3" Flanges; Single Blade Flange Sets 40 mm Blade I.D. (1.575") - 4" Flanges; Single Blade Flange Sets 88 mm Blade I.D. (3.497") - 4 Inch Flange Handling Kit - Dynamic balancing of Flange set - High Cooling Flange set - Multi Gang Blades Flange set |
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Dicing
Equipment - Advanced Dicing Technologies Ltd. (ADT)
is a world leader in the development and manufacture of dicing
saws and laser scribing systems, dicing blades and processes
used in the dicing of Silicon-based Semiconductor Wafers and
hard materials including Glass, Ceramics, Ferrites, MEMS and
in package singulation. |
Further
Information On ADT Dicing & Scribing Blades: |
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| Applications | Dicing
Semiconductor Wafers and Cutting Hard Materials, Cutting Precision
Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites,
Scribbing & Dicing Ceramic, Cutting Glass & Glass Filters,
Dicing MEMS, Package Singulation etc., PCB Separation, Universities
Wafer Processing, Passive Component Manufacturing, Medical Devices,
Glass Device Processing |
| Industry Segments | Semiconductor
Production, Military & Aerospace, Telecommunications, Medical
Electronics, Fiber Optics / Photonics, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Passive
Component Manufacturing, Medical Devices, Glass Device Processing |
| Technical Papers | Dicing
Process - Handling Tips.pdf (
87 Kb) |
| Technical Advice | |
| ADT Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
