Inseto
Fully Automatic Dicing Systems: ADT - 7200 Series
 |
The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications, with systems available for up to 300mm (12") substrates / wafers. 7200 Series Advantages: - Unique Wx3 wafer handling system streamlines productivity |
Fully Automatic Dicing Systems Model Range Overview:
 |
7200
ProDice Fully Automatic Semiconductor Wafer Saw. 2"-3", DC-brushless, Air-bearing, 1.2 kW, 60 krpm spindle system, optimized for IC applications. |
 |
GigaDice 4"-5" High-torque, DC-brushless, Air-bearing, 2.5 kW, 30 krpm spindle system, optimized for automated dicing of hard materials. |
 |
MegaDice 2"-3" High-torque, DC-brushless, Air-bearing, 2.4 kW, 60 krpm spindle system, optimized for package singulation and IC applications |
Download
7200 Series 
Datasheet 1.7MB |
|
Further
Information On ADT Cutting & Scribing Equipment: |
|
| Applications | Dicing
Semiconductor Wafers and Cutting Hard Materials, Cutting Precision
Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites,
Scribbing & Dicing Ceramic Components, Cutting Glass &
Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly
Industries, Universities Wafer Processing, Passive Component
Manufacturing, Separating Medical Devices, Glass Device Processing |
| Industry Segments | Semiconductor
Production, Military & Aerospace, Telecommunications, Medical
Electronics, Fiber Optics / Photonics, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Passive
Component Manufacturing, Medical Devices, Glass Device Processing |
| Technical Advice | |
| ADT Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
|
homepage
> products
> microelectronic
equipment > advanced
dicing technologies > Fully Automatic Dicing Saws |
|
