ADT - NextStep Scribing Technology

With ever-increasing transistor density, shrinking metal lines and gate dimensions, producers are forced to use metals of higher conductivity such as copper, "low-k" isolation materials such as "black diamond" and more test pads.

These new manufacturing standards set a different threshold for wafer singulation whereby traditional step cut dicing no longer meets the quality requirements and cost targets for manufacturing. ADT meets the market challenge with a new, revolutionary type of laser for wafer scribing

ADT’s NextStep system removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually unaffected. The wafer can then be diced using a standard mechanical dicing process.

System Advantages:

- Silicon transparency to the radiation
- No micro-cracking and no delamination
- One pass process at 600 mm per second
- Attractive cost-of-ownership