Inseto
Peripheral Dicing Equipment By ADT
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ADT offer a broad range of peripheral equipment that, along with their dicing systems, provides comprehensive and complementary solutions for our customers. We offer off-the-shelf configurations as well as tailor-made modifications to comply with specific customer requirements. - Tape Curing Systems |
Peripheral Dicing Equipment Overview:
| 977 Series
Wafer Cleaning Systems ADT Wafer Cleaners are designed for efficient cleaning workpieces after dicing. The systems are offered in two basic configurations for up to either 8 or 12" round wafers / substrates. System Highlights: - Atomizing cleaning - Automatic lid closing - Intuitive control panel - Process monitoring - Compact design - Robust, vibration free - Environmentally friendly - Options: Build-in mist exhaust unit, CO2 injection, Customized chucks & Cleaning additives |
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966
Wafer Mounting Systems ADT's componenet presentation Systems enable mounting of wafers/substrates to frames using various kinds of tapes. The systems are offered in two basic configurations for up to either 8" or 12" substrates. Systems features: - Uniform mounting without air bubbles - Build-in reeling and removal of UV tape backing - Mounting plate temperature control - Compatibility with all film frames; linear and circular tape cutting - Custom-made chucks: Thin wafers, Sensitive surfaces, Multiple panels etc. - Options: ESD protection, Tape saving mechanism |
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Tape Curing System - Models 955 ADT UV Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment. The models for up to 8" or 12" wafers are compact & elegant in design- ideal for tabletop use, incorpate lamp life sensors with LED indicators, advanced & unique electronic control panel, are compliance with the highest safety standards & environmentally friendly. |
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Spindle Coolant Chiller
- Model 934 Stabilize your process with a cost-effective solution. The ADT 934 Chiller is designed to provide cooling water for the saw spindle. The water circulates from the chiller to the spindle and back, and maintains a constant flow and temperature level. Compact design, small footprint; High Capacity (one system for two spindles); Safe monitoring of temperature, flow and fluid level; Microprocessor controller for easy setup and operation; Reduces operation costs by eliminating the need for water treatment; Protects the spindle from limescale, corrosive dissolved minerals and particulates found in tap water |
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CO2 Reionizer
System - Model 940 The ADT 940 DI Water Re-ionizers are designed to eliminate particle adhesion and device damage caused by electrostatic effects. The units dissolve CO2 gas into de-ionized water (DI) used for dicing or cleaning processes, thus performing consistent control over an optimal level of resistivity. System Highlights: - Resistivity target setting - Ability to integrate with up to two ADT saws simultaneously - Accurate resistivity control through PID technology |
Water
Control Circulation System - Model 921 Improve your dicing process with our environment friendly system. The CLF 921 Water Control Circulation Systems creates an optimal emulsion for cooling the blade by constantly mixing, cooling and filtering water used during the dicing process with a suitable additive, helping ensure consistent cut cutting quality and prolonging blade life. The system offers provides environmentally- friendly conditions, integrating with up to two ADT saws simultaneously. |
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Mist
Venting Models 913 / 914 Keeping your dicing chamber clear. The ADT 913 & 914 Mist Venting units are designed to vent out mist and light dicing particles out of the dicing chamber. System Highlights: - High performance and quite operation - Ability to integrate with up to two ADT saws simultaneously (Model 913) - Two-stage mist filtration (Model 913) |
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Further
Information On ADT Peripheral Dicing Equipment: |
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| Applications | Dicing
Semiconductor Wafers and Cutting Hard Materials, Cutting Precision
Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites,
Scribbing & Dicing Ceramic Components, Cutting Glass &
Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly
Industries, Universities Wafer Processing, Passive Component
Manufacturing, Separating Medical Devices, Glass Device Processing |
| Industry Segments | Semiconductor
Production, Military & Aerospace, Telecommunications, Medical
Electronics, Fiber Optics / Photonics, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Passive
Component Manufacturing, Medical Devices, Glass Device Processing |
| Technical Advice | |
| ADT Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
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