Inseto
Semiautomatic Dicing & Scribing Systems: ADT - 7100 Series
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With four different models to choose from, each optimized for a specific range of applications, the 7100 Series covers the full spectrum of dicing materials from IC wafers to package singulation and hard material application. The 7100 Series offers the lowest possible cost -of- ownership while providing the most advanced dicing technology. 7100 Series Advantages: - 2” and 4” spindle dicing systems |
Semiautomatic Dicing Systems Model Range Overview:
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7100
2" Vectus+ DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.) Optimized for simple, two-channel alignment of thin material applications up to 150 mm x 150 mm with a low unit cost per device, such as: - Low Cost Semiconductor Devices - Discrete Surface Mount Devices - Standard LED Packages - Thin-film Devices - LTCC Substrates |
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7100
2" ProVectus DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable Optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm, such as: - Opto-electronic Components - PCB BGA Panels - High-brightness LED Packages - Silicon Wafers - SAW Filters - Glass/Silicon Sensors - MEMS - PZT |
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4"
Fortis + 4", AC, 1.7 kW, Air-bearing Spindle (30 krpm Max.) Optimized for single substrate dicing of thick material applications up to 150 mm x 150 mm with a relatively low unit cost per device, such as: - Ceramic Substrates - Alumina - Hybrids - Thick-film Devices |
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4"
ProFortis 4", DC-brushless, 2.5 kW, Air-bearing Spindle, (30 krpm Max.), with closed-loop turntable Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 200 mm x 200 mm, such as: - Glass - DWDM Optical Filters - Thick Ceramic Substrates |
Download
7100 Series 
Datasheet 1.7MB |
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Further
Information On ADT Cutting & Scribing Equipment: |
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| Applications | Dicing
Semiconductor Wafers and Cutting Hard Materials, Cutting Precision
Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites,
Scribbing & Dicing Ceramic Components, Cutting Glass &
Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly
Industries, Universities Wafer Processing, Passive Component
Manufacturing, Separating Medical Devices, Glass Device Processing |
| Industry Segments | Semiconductor
Production, Military & Aerospace, Telecommunications, Medical
Electronics, Fiber Optics / Photonics, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Passive
Component Manufacturing, Medical Devices, Glass Device Processing |
| Technical Advice | |
| ADT Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
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