Inseto
Flexible Microelectronics Assembly & Die Bonding Systems By Amadyne
Amadyne, provide equipment for the automation of production processes including epoxy and eutectice die attach / bond, adhesive dispense and inspection within the Microelectronic and Opto-Electronic markets. With over 15 years experience of industrial automation, they offer a range of standard products (see FAB & SAM42 details below), and specialist automation solutions.
Amadyne's standard products include the FAB Series of Fast Automatic Bonders, the SAM42 Semi Automatic Component Handling System for flexible microelectronics assembly.
Product range overview (click image below for more detailed information):
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FAB - Fast Automatic
Bonder (FAB) offers improved speed and accuracy and incorporates
the very latest in motion control & software technology,
whilst not compromising on flexibility. The system is housed
inside a novel cabinet, which incorporates particulate control
filters, system status illuminators and an exceptional working
area that can accommodate up to two wafers for parallel processing.
System features include: - Elegant Graphical User Interface - Large Working Area - High Pick & Place Accuracy - Automatic Dispense Module Change - Customer Specific Integration - Single & Multiple Cell Configurations - Inline Capable |
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SAM42
- The SAM42 is an automatic batch system, which is new concept
in pick and place capable of die and component assembly from
wafer, waffle or reel, in a small (less than 0.6M sq), bench
mounted footprint. The SAM42 system is designed for R&D
through medium volume assembly operations and offers exceptional
flexibility, using some of the latest positioning, image processing,
electronics and software technology available. |
Further
Information On Amadyne Flexible Automatic Die Bonding Systems: |
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| Applications | Hybrid
Assembly, Die Bonding, Production Of Microelectronic Devices,
Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, RF & Microwave Assembly, Power
Hybrid Assembly, Pick & Place, Module Assembly, Test Integration |
| Industry Segments | Automotive,
Aerospace, Military, Telecommunications, Medical Electronics,
Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics,
Power Semiconductor Assembly, Semiconductor Back-end Assembly,
PCB Assembly Industries, Universities |
| Technical Advice | |
| Amadyne Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
