Inseto
Fully Automatic Flexible Die Bonders: FAB Series
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The new fab modules provide the same rich features, ease of use and high flexibility the SAM42 is famous for. In Addition the new machines also provide something repeatedly requested: SPEED! Fab is a completely new design, regarding software as well as hardware. Some Highlights - Massive aluminum die cast base with integrated linear servos
and servo driven Z-axis The fab modules also offer an extensive list of software and hardware featuers. |
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Graphical User Interface |
Dispense Service Module |
Process Control Module |
Datasheet 2.3MBFurther
Information On Amadyne Microelectronic Assembly Automation Equipment: |
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| Applications | Hybrid
Assembly, Die Bonding, Production Of Microelectronic Devices,
Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, RF & Microwave Assembly, Power
Hybrid Assembly, Pick & Place, Module Assembly, Test Integration |
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| Industry Segments | Automotive,
Aerospace, Military, Telecommunications, Medical Electronics,
Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics,
Power Semiconductor Assembly, Semiconductor Back-end Assembly,
PCB Assembly Industries, Universities |
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| Technical Advice | ||
| Amadyne Website |  |
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| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
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| homepage > products > microelectronic equipment > amadyne die assembly equipment > Amadyne FAB | ||
