The SAM42 is a new concept in pick and place, which is capable of die and component assembly from wafer, waffle or reel, in a small (less than 0.6M sq), bench mounted footprint.

The SAM42 system is designed for R&D through medium volume assembly operations and offers exceptional flexibility, using some of the latest positioning, image processing, electronics and software technology available.

SAM42 is capable of assembling the widest range of devices, including Single-Chip, Multi-Chip, COB, Flip Chip, Chip on Chip etc. Dice ranging from 0,5mm x 0,5mm up to 25mm x 25mm in size can be handled in all commonly available presentation forms i.e. Wafer (up to 12"), Waffle Pak, GEL PAK and Tape Feeder etc. With 16" x 16" SAM42 also offers the largest working area in its class, whilst being able to incorporate standard or customized specific component handling.

The basic system provides 4 computer controlled axes driven by high precision motors. Together with the image processing system, SAM42 can achieve placement accuracies up to 25µm @ 3 sigma.

The system features:

• Flexible Pick & Place System
• Windows based graphical user interface for simple programming & use
• Large multi-function work-area 400x400mm
• Pick up from wafer (up to 300mm)
• Pick up from tape & reel, waffle pack, gel pack etc.
• Die flip chip option
• Dispensing, epoxy writing or epoxy transfer
• Integrated vision with upward and downward camera options
• CAD data import for program setup
• Manual operator driven or fully automatic assembly modes

Download SAM42 Datasheet 1.2MB