Inseto
Vacuum Soldering & Thermal Processing Equipment By ATV Technologie
ATV Technologie GmbH located in Munich, Germany and founded in 1972 manufacture a range of equipment for various thermal processes, including rapid ramping furnaces, cold-wall solder processing / reflow equipment, hot plates, LTCC sintering presses, atomic layer deposition equipment, as well as diamond scribing systems for wafers and other devices.
ATV Technologies prides itself on providing high quality, versatile systems engineered according to the customer’s specific requirements.
Product range overview:
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Multi-Purpose Process Furnaces - For Semiconductor and advanced
electronic production operations are fast ramping and cooling,
space saving & energy efficient benchtop ovens with quartz
process chambers, for temperatures ranging to 1250°C with
devices up to 300mm diameter. Systems can have integrated IR
heaters, acheive Vacuum down to 5 x 10-6 mbar/Torr, Oxygen <1ppm,
have multiple process gases and a pure Hydrogen option. Applications
uses include LPCVD, Expitaxy, Annealing, Diffusion, Wet/Dry
Thermal Processes, HCI-Cleaning, Polyimide Curing, Alloying,
Oxidation, low k Dielectrics, Wafer Bump Reflow, Fluxless Reflow
Soldering, LTO, Thickfilm Paste & LTCC Sintering. |
 |
SRO Perfect Vacuum Soldering
Systems - For Thermal Transfer Applications
requiring processing under vacuum, or with process gases, including
Void Free Solder Reflow, Package Lid Sealing, Annealing Die
Attach & Substrate Bonding, Alloying, Flip Chip / Thermocompression
Wafer Bonding, Flip Chip Bump Reflow, Popcorn Effect Analysing
& other rapid thermal processes etc. |
 |
High Precision Hot Plates
& Chucks for Reflow Soldering, Brazing, Pre-Heating, Annealing,
Curing, Baking, Bonding & Eutectic Reflow Solder applications.
Simple to use, extremely reliable and robust, excellent temperature
uniformity, rapid ramping, vacuum clamping, maximum temperature
360°C/450°C with higher versions & customised requirements
on request. |
 |
Manual & Precision
Diamond Scribers - For Accurate Scribing Of Ceramic Components,
Glass Substrates and Silicon Wafers. Various models available
with options including Vacuum Chucks, Fine Adjust & Cross
Hair Alignment, for scribing up to 220mm scribe lines (model
dependent). |
Further
Information On ATV Products: |
|
 Datasheet (PDF) |
ATV Product Line Overview 870kB |
| Applications | Thermal
Processing, Curing, Solder Reflow, Brazing, Semiconductor Device
Characterisation & Processing, Annealing, Curing, Cleaning,
Epitaxy, Alloying, Thermal Processing, Fluxless Soldering, Void
Free Soldering, LTCC Sintering, LPCVD, Diffusion, Wafer Scribing
& Wafer Bonding etc. |
| Industry Segments | Semiconductor,
Automotive, Aerospace, Military, Telecommunications, Medical
Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Medical
Devices |
| Technical Advice | |
| ATV Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
