Inseto
2D & 3D Wafer Inspection Systems From Camtek
Camtek Ltd. develops and manufactures automatic optical inspection (AOI) and metrology systems for the inspection of finished semiconductor wafers.
Advanced packages, such as stacked die, 3D package, System-in Package (SIP), Flip-Chip and Fine-Pitch wire bonding are sensitive to defects in the die interconnect areas. Camtek inspection equipment assists wafer fabs, bumping houses providers and packaging foundries address these challenges with advanced systems that deliver outstanding 2D and 3D inspection and metrology capabilities. These systems fit right into the most advanced production environment, and handle bare and frame-mounted wafers up to 300mm in diameter
Systems are available for either 2D or 3D fully automatic wafer-level inspection and analysis or for cut quality defects (Kerf) and wafer surface defects after sawing.
Product range overview:
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Falcon 500 Series for general wafer inspection
inspects wafers before and/or after functional testing for surface,
probe mark and bump defects that may impact die integrity or
interconnect reliability. |
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Falcon
500PD Series for post-dicing inspection of framed wafers
detects 2D surface, probe mark, bump and dicing-related defects.
Die alignment technology ensures reliable detection even when
cut dice have shifted on the wafer. |
 |
Falcon
600 Series for special applications handles fully automated
optical wafer inspection for complex products such as MEMS and
WLP. Camtek’s Falcon 600 is a versatile and flexible inspection
platform designed to enable easy customization for a wide variety
of non-standard applications. Designed to handle unframed and
frame-mounted wafers, Falcon 600 models deliver the superb detection
ability, high throughput and ease of operation the Falcon family
is known for. |
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Falcon
800 Series for bumped wafer metrology offers fast,
precise 2D and 3D inspection of all bumps on a wafer and reports
die coplanarity. Falcon 800s inspect solder and gold bumps for
height, size, shape and placement deviations, as well as detect
die surface defects. |
Further
Information On Camtek Wafer Inspection Equipment: |
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| Applications | Semiconductor
Wafer Defect Inspection, Framed Wafer Defect Inspection, Unframed
Wafer Defect Inspection, Wafer Probe Mark Inspection, Post-Sawn
And Diced Wafer Defect Inspection, Bumped Wafer Inspection,
2D Wafer Inspection, 3D Wafer Inspection, Top Side & Backside
Wafer Inspection, Wafer Metrology Systems, Micro-level defect
Inspection, KGD - Known Good Die Inspection, Semiconductor Quality
Insurance & Process Control |
| Industry Segments | Semiconductor
Wafer Fabrication, Semiconductor Incoming Inspection, Wafer
Bumping Services, Semiconductor Test & QA Houses |
| Technical Advice | |
| Camtek Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
