Inseto
Bond Testing Systems By Nordson DAGE
Nordson DAGE has a strong portfolio of products for destructive and non-destructive mechanical testing and inspection of electronic components including wire pull, bond shear, die shear, tweezer & stud pull, fatigue testing etc.
With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as BGAs, Chip Scale Packages (CSP) and other electronic components. Their commitment to continuous development has ensured that products are brought swiftly to market to support customers in emerging technology sectors. A philosophy that has most recently led to the development of products for 300 mm wafer bump shear.
Product range overview:
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Nordson
DAGE 4000Plus is the most advanced bondtester on
the market. This next generation system represents the industry
standard in bond testing and offers unsurpassed accuracy and
repeatability of data, providing complete confidence in results.The
4000Plus multi-purpose bondtester performs shear tests up to
500kg, pull tests up to 100kg and push tests up to 50kg, covering
all test applications including new hot bump pull and fatigue
applications. |
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Nordson
DAGE-SERIES-4000 is a modular Multi-Function Bondtester,
capable of meeting all pull and shear applications. This system
can be configured as a simple wire pull tester, and upgraded
to provide ball shear, die shear or tweezer pull tests. The
4000 uses the Dage Frictionless Patented Load Cartridge Systems
and Air Bearing technology, to ensure maximum accuracy, repeatability,
and reproducibility. |
Further
Information On Dage Bond Testers: |
|
| Applications | Semiconductor
Defect Analysis & Charracterisation, Wire Bond Testing,
Validation Of Process & Machine Setup, In Process Quality
Control, Wire Bond Strength Analysis, Materials Testing, Die
Shear & Bond Shear Strength Checks |
| Industry Segments | Semiconductor,
Automotive, Aerospace, Military, Telecommunications, Medical
Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Medical
Devices |
| Technical Advice | |
| Nordons-DAGE Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
