Inseto
DELO - Reference Applications
DELO's adhesives, including are used for joining, bonding, sealing, encapsulation, potting, gasketing, mould etc., throughout a wide range of industries.
A range of example applications are detailed below:
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Microelectronic
Applications - DELO manufacture a range of high
purity materials for assembly processes including die attach,
glob-top encapsulants, dam / fill materials, flip chip underfill
materials, plus light activated and light cured adhesives for
encapsulation, sealing and joining: * Die Attach Adhesives * Glob Top and Encapsulation * Dlip Chip Underfills |
| Click HERE to view more information on DELO's adhesives for Microelectronic Applications | |
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Automotive
Applications- Approximately 25% of DELO's research
and development resources is used researching adhesives for
the automotive sector. About 15 kgs of adhesive per car are
used in todays automotive construction, resulting in: * Reduced production cycle times * Improved rigidity in construction * Increased impact protection * Sound and vibration deadening * Reduction in weight |
| Click HERE to view more information on DELO's adhesives for Automotive Applications | |
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Thin
Film P.V. (Photo Voltaic) and Silicon Solar Panels
- DELO adhesives are used in the production of the thin-film
cells replacing soldering as a joining method, in addition to
their use in conventional silicon solar cells and to hold silicon
ingots during the cutting process: * Contacting Thin Film & Silicon Cells * Wafer Ingot Bonding |
| Click HERE to view more information on DELO's adhesives for PV Applications | |
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Adhesives
For Plastics & Glass Applications - DELO produce
adhesives that provide high strength boning and sealing with
minimum tension and excellent optical properties and plastic
processing offering adhesion to different plastics like PET,
PVC, PA, ABS, PC, PMMA, PBT etc. |
| Click HERE to view more information on DELO's adhesives for Plastics and Glass Applications | |
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Adhesives
For Mechanical Engineering Applications - Simple and
easy processing, durable strength, weight and energy saving
as well as aesthetics, have convinced design engineers to use
adhesives in this field. The classic product groups for metal
processing are two-part epoxy resins and anaerobic curing methacylates
and two-part polyurethanes: * Metal Bonding & Sealing * Replacement for traditional joining methods |
| Click HERE to view more information on DELO's adhesives for Engineering Applications | |
Further
Information On DELO Industrial Adhesives: |
|
| Applications | Bonding, Glob-Top, Encapsulation,
Z-Axis Bonding, Sealing, Potting, Underfill, Protection Against
Vibration, Conductive Electrical Connection, Underfill, Dam
& Fill, Securing, High Strength Mechanical Joining (Can
Replace Soldering or Rivits), Casting, Potting, Gap Filling
etc. |
| Industry Segments | Electronics, Microelectronics,
Semiconductor, Automotive, Energy, Aerospace, Medical, Engineering,
Plastics, Glass, Consumer Devices etc. |
| Technical Advice | |
| Region | Available
from Inseto in the United Kingdom & Ireland |
