Inseto
Adhesives For Electronics Assembly By DELO
DELO manufacture a range of adhesives with low ionic levels for electronic applications, including conductive and non-conductive die attach adhesives, glob-top encapsulants, dam / fill materials, flip chip underfills, plus light activated and light cured products for encapsulation, sealing and joining.
More information on DELO's entire range of adhesives can be found in our Adhesives Division.
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Heat
Cured Glob-Tops: DELO have introduced a new range of
heat cured glob-top materials. These exhibit low CTE's (<
20ppm), high Tg (>150 DegC) with curing schedules of 1hr
max at 150Deg C. |
 |
Die Attach & Underfill Materials: DELO offer a conductive Flip Chip
Underfill which is both an underfill and an adhesive, enabling
users to reduce the number of process steps and time, thereby
reducing costs. |
 |
UV
& Light Curing Adhesives - DELO manufactures a
range UV & Light Curing materials with short curing times
for bonding, sealing and potting of electronic components and
assemblies. |
Further
Information On DELO Adhesives for Electronic Applications: |
|
| Applications | Bonding,
Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Underfill,
Protection Against Vibration, Conductive Electrical Connection,
Underfill, Dam & Fill |
| Industry Segments | Microelectronic
/ Hybrid Assembly, Semiconductor Assembly / Back-end Assembly
etc., Fiber Optics / Photonic Assembly, Microwave Electronics,
OEM Equipment Manufacturers, Precision Components & Assemblies,
PCB Assembly, Electronic Component / Device Assembly, Smart
Cards, Smart Labels, RFID, Automotive Electronics etc. |
| Technical Advice | |
| DELO Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
