Reliability is paramount in microelectronic applications, whether the adhesive is used in military or commercial products. Delo’s high-purity, low CTE adhesives provide the perfect combination for use in all applications. With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, etc.) and an extended working life, our conductive and insulating adhesives meet our customers’ requirements.

Die attach adhesives are used in widely differing applications - semiconductor assembly onto leadframes, hybrid assembly onto alumina, commercial FR4 applications, etc - and therefore must meet a wide range of requirements.

Delo has developed products specifically designed for such applications, featuring:

• A wide product range for a variety of substrates
• High throughout due to reduced cycle times and innovative processes such as light-fixing
• Reduced costs as a result of extended processing times
• High temperature stability up to 260C allowing for lead-free assembly
• Low humidity sensitivity due to <0.3% water absorption
• High purity with <10ppm ionic impurities

New developments include dual-curing adhesives that allow very fast fixing of the components by illuminating the adhesive fillet with UV light, and subsequent curing of the adhesive under the component by the application of heat, whether at wire-bonding, over-moulding, or encapsulation.

With an increasing number of temperature sensitive substrates being used in electronic applications, Delo has developed a range of adhesives that use a low-temperature chemistry, allowing the user to apply heat through the component holder rather than via the substrate, ensuring that the substrate material never sees temperatures in excess of 80C.