Inseto
Die Attach (Component Pick and Place Equipment) & Rework Systems By Dr Tresky
Since 1980, the Dr. Tresky AG company has been supplying the micro and opto electronics industry with innovative component placers and die bonders. Over 900 units throughout the world have been installed to meet critical process and placement requirements. Our worldwide network of distributors provides the technical support for our customers.
Dr. Tresky AG designs and manufacture high quality equipment for : Die Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic, Microsystems and many more.
Product range overview:
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T-4909
Budget Sensitive Manual Die Bonder - The T-4909
is a manual, high quality die bonder with superior ergonomic
design. As with all of Tresky’s products, the T-4909 incorporates
True Vertical Technology™ which guarantees parallelism
between the chip and substrate at any bond height. |
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T-3000/2-M
Flexible Manual Bonder - Excellent performance,
ergonomically designed and high reliability make the model ideal
for small to complex production with exceptional ergonomic controls.
A cycle time of approx. 4 sec. (process depending) and various
development applications provides a system capable low to high
throughput requirements. |
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T-3000/2-FC3
Semi-automatic Bonder - A precise, high quality,
versatile die bonder & component placer with superior ergononomic
design and programmable, high accuracy motorised Z-Drive and
bonding force control. Excellent performance, ergonomic design
and high reliability make the T-3000-FC3 ideal for small and
medium production and various development applications. The
automated Z-Drive with bond force control, enables a high repeatability
of bond parameters. |
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T-3000-RD
High Force Capable Bonder - Incorporates
semi automatic process capabilities for low or high
bonding forces with precise placement. The T-3000-RD is specially
designed with a motorised Z axis that can provide accurate control
of the bond forces fro 10g to 10Kg (other force ranges available:
25Kg or 50Kg bond head). |
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R-SYSTEM 600
/ 1200 Rework System - R-System600
and R-System1200 is a stand alone easy to use system for nearly
all SMD Rework applications. The precise placement supported
by a split optic gives the possibility to rework all common
components. |
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T-CHIPEX 1
Chip Removal - The Hybrid Rework System T-Chipex
1 removes all glued dies from substrate. |
Further
Information On Dr Tresky Bonding & Rework Equipment: |
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| Applications | Microelectronic
Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, Bio Medical Assembly, Nanoelectronics,
MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules,
Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic
Die Attach, Adhesive Die Bonding |
| Industry Segments | Semiconductor,
Automotive, Aerospace, Military, Telecommunications, Medical
Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Medical
Devices |
| Technical Advice | |
| Dr Tresky Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia/Nordic
Region |
