Kulicke & Soffa (K&S) Manual Wire Bonders

K&S Manual Wire Bonding Systems for process development, production or research, provide excellent ease of use, optimum bond quality and repeatability, plus the reliability needed for the most challenging bonding applications.

Kulicke & Soffa Ultrasonic Wire bonders are available with Semi-automatic and manual operation modes, individual bond parameter control and capacity for a wide range of wire diameters enable ease of use in gold ball bonding, ball bumping, coining, security bonding, single-point TAB, thermosonic, aluminium or gold wedge and ribbon bonding applications.

Manual Wire Bonding Equipment Overview:

K&S 4526 Manual Wedge Bonder
K&S 4526 Wedge Bonder with Analog Controls - The 4526 K&S manual wedge bonder is simple to set-up and for ease of use incorporates analog controls, which allow rapid adjustment of individual bonding parameters. The system is capable of ultrasonically bonding a wide range of gold / aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250micron ribbon. A motorised Y axis with auto-stepback provides controlled wire length and repeatable loop formation. In addition, the system has a large working area and table motion, with excellent Z axis clearance, for bonding small through large devices.....more
K&S 4522 Analog Gold Ball Wire Bonder For Bonding Gold or Copper Wires
K&S 4522 Ball Bonder With Analog Controls - The 4522 is an advanced bench-top manual gold ball wire bonder with operator initiated controls and analog adjustments, which allow rapid adjustment of individual bonding parameters. The system is capable of ultrasonically bonding gold wires from 18 - 75 micron. A system features a large bonding area up to 6 x 6", consistent ball size control via negative EFO, missing ball detection with auto-stop and advanced loop controls. A copper conversion kit is also available.....more
iBond5000 Convertible Ball and Wedge Bonder
K&S iBond5000 Convertible Ball & Wedge Bonder - The iBond5000 is the newest creation from market leader K&S. The series is based on the Company's 4500, and integrates the proven legacy K&S mechanical design with advanced electronics to provide modern capabilities. The iBond5000 series includes ball, wedge and dual-capability bonding options.

The iBond5000 Ball, iBond5000 Wedge, and iBond5000 Dual are advanced bonders used for process development, production, research and supplemental manufacturing support. They provide the excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-boards, Leads, Sensors and High Power Devices.....more
Refurbished Wire Bonders From K&S Manual 2nd User Wire Bonding Equipment
Refurbished K&S Wire Bonders - Fully refurbished 2nd user Kulicke and Soffa manual ultrasonic gold ball and wedge wire bonding equipment. Refurbished models include 41xx & 45xx Series, carry up to six months Parts & Labour warranty and are fully overhauled by K&S trained engineers using genuine OEM parts. Contact us for further information and available models.
Further Information On Kulicke & Soffa Manual Wire Bonding Equipment:
Related Products K&S Orthodyne Wedge Bonders
DAGE Wire Pull and Shear Testers
SPM Coining Bonding Wires
MPP Bonding Wedges
DELO Glob Top Adhesives
Sales Enquiry Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa Website
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