Inseto
Kulicke & Soffa (K&S) Manual Wire Bonders
K&S Manual Wire Bonding Systems for process development, production or research, provide excellent ease of use, optimum bond quality and repeatability, plus the reliability needed for the most challenging bonding applications.
Kulicke & Soffa Ultrasonic Wire bonders are available with Semi-automatic and manual operation modes, individual bond parameter control and capacity for a wide range of wire diameters enable ease of use in gold ball bonding, ball bumping, coining, security bonding, single-point TAB, thermosonic, aluminium or gold wedge and ribbon bonding applications.
Manual Wire Bonding Equipment Overview:
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K&S 4526 Wedge Bonder - The 4526 K&S manual wedge bonder is simple to set-up and for ease of use incorporates analog controls, which allow rapid adjustment of individual bonding parameters. The system is capable of ultrasonically bonding a wide range of gold / aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250micron ribbon. A motorised Y axis with auto-stepback provides controlled wire length and repeatable loop formation. In addition, the system has a large working area and table motion, with excellent Z axis clearance, for bonding small through large devices. |
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K&S
4523 Wedge Bonder With Digital Controls - The 4523
is an advanced bench-top bonder with operator initiated, manual
through automatic bonding modes. The system is capable of ultrasonically
bonding a wide range of gold / aluminium wires and ribbons from
12 - 75 micron wire through 25 x 250micron ribbon. A digital
interface manages up to 200 programs, with up to six channels
per program. This systems allows quick adjustment of machine
settings and for programs to be stored or recalled instantly.
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K&S 4522
Ball Bonder With Analog Controls - The 4522 is an advanced
bench-top manual gold ball wire bonder with operator initiated
controls and analog adjustments, which allow rapid adjustment
of individual bonding parameters. The system is capable of ultrasonically
bonding gold wires from 18 - 75 micron. A system features a
large bonding area up to 6 x 6", consistent ball size control
via negative EFO, missing ball detection with auto-stop and
advanced loop controls. |
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K&S 4524
Ball Bonder With Digital Controls - The 4524 is an
advanced bench-top gold ball bonder capable of ultrasonically
bonding gold wires from 18 - 75 micron. A digital interface
manages up to 200 programs and allows quick adjustment of machine
settings and for programs to be stored or recalled instantly.
A motorised Y axis with auto-stepback provides controlled wire
length and repeatable loop formation. In addition, the system
has a large working area and table motion, with excellent Z
axis clearance, for bonding small through large devices. |
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K&S 4700
Convertible Ball & Wedge Bonder - Ball Bonding
and Wedge Bonding on ONE Machine! The system is based on the
proven K&S 4500 Series, the market leader for nearly a decade
and features analog dials for ease of use, combining the best
features of the workhorse 4523 and 4524 models. Wedge or Capillary
mounting is easy and precise with a special transducer, unique
to K&S Model 4700. No tools required for changeover, just
swing the EFO assembly to the proper position and press a switch
to select ‘Ball Bonding' or ‘Wedge Bonding' process..
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Refurbished
K&S Wire Bonders - Fully refurbished 2nd user Kulicke
and Soffa manual ultrasonic gold ball and wedge wire bonding
equipment. Refurbished models include 41xx & 45xx Series,
carry up to six months Parts & Labour warranty and are fully
overhauled by K&S trained engineers using genuine OEM parts.
Contact
us for further information and available models. |
Further
Information On Kulicke & Soffa Manual Wire Bonding Equipment: |
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| Applications | Microelectronic
Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, Microelectronic Devices, Bio Medical
Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board
Assemblies, Multi-Chip-Modules, Semiconductor Components, Development |
| Industry Segments | Automotive,
Aerospace, Military, Telecommunications, Medical Electronics,
Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave
Electronics, Microelectronics, Power Semiconductor Assembly,
Semiconductor Back-end Assembly, PCB Assembly Industries, Universities |
| Technical Advice | |
| Kulicke & Soffa Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
