Inseto
Kulicke & Soffa (K&S) Wire Bonders & Die Bonding Equipment
Kulicke & Soffa (K&S) are the world leaders for manual and semi-automatic, bench mounted wire bonders. The KnS gold wire bonders, copper stud bump / wire & aluminium ultrasonic bonding systems are very easy to operate and are ideal for universities, development laboratories through to medium volume production facilities.
K&S also produce a range of fully automatic ball bonders for high speed IC & MCM assembly, flexible large area hybrid markets and stud bumpers for up to 12" wafers, as well as automatic die bonding systems. These systems provide higher productivity and yields, whilst enabling production of the most complex packages at the lowest cost.
Product range overview (click image below for more detailed information):
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K&S Manual Wire Bonders - Leveraging nearly four decades of experience in developing manual bonding systems, K&S continue to innovate, delivering market leading bench top wire bonding systems for gold ball and bump bonding, ultrasonic aluminium or gold wedge, for small wire or ribbon applications. |
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K&S
Automatic Gold Ball Wire Bonders - A new level
of wire bonding performance. The IConn is built upon the new
Power Series platform, with the most powerful X-Y-Z motion control
system ever designed for assembly equipment, making it the fastest
bonder in its market. |
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K&S
Automatic Wafer Bumpers - The new AT Premier™
Stud Bumper from K&S offers many technological advantages
that make it the ideal choice for a wide range of flip chip
product applications. Using industry-standard modeling, this
new generation high-speed stud bumper is the clear cost-of-ownership
leader in comparison to competitive stud bumping technology.
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K&S
Automatic Die Bonding Systems - Kulicke and Soffa
introduces iStackPSTM the next generation die bonding platform
for advanced stacked die and high performance BGA applications.
iStackPS delivers industry leading throughput and best-in-class
yields by leveraging unique advances in functionality. |
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K&S
Die / Wire Bonding Capillaries & Hub Dicing Blades
- K&S is the worlds leading manufacturer of advanced bonding
capillaries for a broad range of applications from standard
to ultra fine pitch suitable for both Copper and Gold Bonding
Wires. K&S Semitec offers a full range of hubbed dicing
blades for a variety of advanced material applications. |
Further
Information On Kulicke & Soffa Bonding Equipment & Consumable
Products: |
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| Applications | Microelectronic
Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, Microelectronic Devices, Bio Medical
Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board
Assemblies, Multi-Chip-Modules, Semiconductor Components, Development |
| Industry Segments | Automotive,
Aerospace, Military, Telecommunications, Medical Electronics,
Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave
Electronics, Microelectronics, Power Semiconductor Assembly,
Semiconductor Back-end Assembly, PCB Assembly Industries, Universities |
| Technical Advice | |
| Kulicke & Soffa Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
