Serving the IC and MCM/hybrid assembly markets, K&S can support your company's roadmap for complex packages and higher productivity and yields at the lowest cost. Together, K&S automatic and manual wire bonders, bonding tools and wire deliver a complete range of product and process solutions designed to maximize your assembly productivity and help keep your company ahead of the technology curve.
K&S is proud to introduce a new generation of semiconductor assembly equipment. We have named this product line the Power Series of Semiconductor Assembly Products, reinforcing both the powerful capability built into these produts and the power of K&S as a technology leader for more than five decades.
Fully Automatic Wire Bonding Equipment Overview:
| IConn High Performance Gold Ball Wire Bonder - As its name implies, the IConn High Performance Wire Bonder, represents the state-of-the-art in IC inter-Conn-ect performance for advanced packaging requirements of both today and tomorrow. | |
| The IConn is built upon the new Power Series platform, with the most powerful X-Y_Z motion controle system ever designed for assembly equipment, making it the fastest bonder in its market. | |
Further
Information On Kulicke & Soffa Automatic Gold Wire Bonding
Equipment: |
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| Applications | Microelectronic
Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, Microelectronic Devices, Bio Medical
Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board
Assemblies, Multi-Chip-Modules, Semiconductor Components, Development |
| Industry Segments | Automotive,
Aerospace, Military, Telecommunications, Medical Electronics,
Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave
Electronics, Microelectronics, Power Semiconductor Assembly,
Semiconductor Back-end Assembly, PCB Assembly Industries, Universities |
| Technical Advice | |
| Kulicke & Soffa Website | |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
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