Inseto
High Speed Automatic Die Bonders By Kulicke & Soffa (K&S)
Kulicke and Soffa introduces iStackPSTM the next generation die bonding platform for advanced stacked die and high performance BGA applications. iStackPS delivers industry leading throughput and best-in-class yields by leveraging unique advances in functionality.
K&S equipment helps to solve assembly challenges in all kind of markets, such as semiconductor backend, micro system technology, automotive, mobile telephony, industrial electronics and many more.
Fully Automatic Die Bonding Equipment Overview:
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K&S iStack - Kulicke and Soffa introduces iStack next generation die bonding platform for advanced stacked die and high performance BGA applications. iStack delivers industry leading throughput and best-in-class yields by leveraging unique advances in functionality. |
| * New Heated Bond Process: reduces voids twice as fast as conventional bond processes. | |
| * Innovative PTP Processing System: pick and place functions operate in parallel for increased throughput | |
| * Dynamic Calibration: Dispense and bond heads are calibrated. An intermediate staging station with an additional camera provides additional inspection. | |
Further
Information On Kulicke & Soffa Automatic Die Bond Systems: |
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| Applications | Microelectronic
Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, Microelectronic Devices, Bio Medical
Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board
Assemblies, Multi-Chip-Modules, Semiconductor Components, Development |
| Industry Segments | Automotive,
Aerospace, Military, Telecommunications, Medical Electronics,
Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave
Electronics, Microelectronics, Power Semiconductor Assembly,
Semiconductor Back-end Assembly, PCB Assembly Industries, Universities |
| Technical Advice | |
| Kulicke & Soffa Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia |
