Inseto
Manual Die Bonding Machine - Tresky T-4909
The T-4909 Low Cost Manual Die Bonder is a high quality die bonding system with superior ergonomic design. As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between the chip and substrate at any bond height. The T-4909 manual semiconductor die bonder, is suitable for die attach of:
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The ergonomically designed T-4909 is simple to use and operate, provides excellent performance, high-reliability and is ideal for small and medium volume production, research, development and Universities, where users require a small footprint, quick system setup and accurate placement capability.
The equipment features the following capability/options: Tresky's True Vertical Technology™, Z-movement of 60mm with a 360° rotating pickup tool, adhesive / solder dispenser, epoxy stamping, eutectic scrub, pickup tool heating, secondary preform spindle, XY air-cushioned placement stage with micrometer control, which supports the waffle-gel paks, substrate holder and various heating plates.
Download
T-4909 
Datasheet 402kB |
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Further
Information On Dr Tresky Bonding & Rework Equipment: |
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| Applications | Microelectronic
Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor
Components, Development, Bio Medical Assembly, Nanoelectronics,
MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules,
Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic
Die Attach, Adhesive Die Bonding |
| Industry Segments | Semiconductor,
Automotive, Aerospace, Military, Telecommunications, Medical
Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics,
Microelectronics, Power Semiconductor Assembly, Semiconductor
Back-end Assembly, PCB Assembly Industries, Universities, Medical
Devices |
| Technical Advice | |
| Dr Tresky Website |  |
| Region | Available
from Inseto in the United Kingdom, Ireland & Scandinavia/Nordic
Regions |
