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A.D.T.
Allteq Industries
Amadyne
Camtek
Dage
Dr Tresky
Focused Test
Loadpoint Bearings
Kulicke & Soffa
Orthodyne Electronics
SemiProbe

Microelectronics Equipment Division

Provides assembly, test & inspection equipment for the microelectronic, photonic and semiconductor industries.

       

 

 

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Microelectronics Equipment Division

The Microelectronics Division, was Inseto's first product division. It provides manufacturing equipment and consumables for the Microelectronic, Photonic, Nanoelectronic, Solar Cell and Semiconductor industries. Equipment is offered from systems for the inspection of wafers, through wafer probe test, mounting, scribing and dicing, plasma cleaning & surface preparation, die and wire bond, bond test (wire pull / bond & die shear etc.), assembly automation systems, to final inspection and test.

Full technical support including process and operation / maintenance is provided, with extensively trained field personnel and information databases. Training either at Inseto's training facility or onsite, can be provided to maximise equipment productivity and optimise quality of results.

 

 

 
Advanced Dicing Technologies - A.D.T.
A world leader in the development and manufacture of dicing saws, laser scribing systems & blades used in the dicing of Silicon-based Semiconductor Wafers and hard materials including Glass, Ceramics, Ferrites, MEMS and in Package Singulation
 

Allteq

After wire bond inspection systems, for boat or leadframe carried devices

 

Amadyne

Flexible microelectronic pick & place systems, die bonding equipment and die sorting machines in manual-inline configurations. Automation systems for Microelectronics assembly processes including pick & place, dispensing, UV & snap curing, eutectic soldering, flip chip etc.

 
  

Camtek

Automatic optical inspection (AOI) systems for wafer-level inspection and analysis of flip chip bumps, cut quality defects (Kerf) and wafer surface defects

 
  
Dage Group  
Manufacturers of wire bond testing equipment for pull test, bond shear and die shear, stud pull, fine pitch shear testing with high accuracy, repeatability and ease of use
   
Dr Tresky 
Manufacturers of high quality equipment renowned for its exceptional ergonomics and flexibility used for component pick and place and die bonding. More recently Dr Tresky have also introduced a range of advanced rework systems.
 

Focused Test

ATE Component Test Manufacturer, test capabilities include power discrete and analog IC ATE for analog devices & high power devices with multi-site test capability to MIL Standard 750

   

Loadpoint Bearings

Loadpoint Bearings is the leading manufacturer & repair company of Dicing Spindles supplying all original equipment manufacturers & end users in the world with products that have become accepted as industry standards.

 
  

Kulicke & Soffa

Manufacture modern semi-automatic bench mounted wire bonders, for gold ball & wedge bonding of ribbon or wire, automatic gold ball and bump bonders and automatic die bonding and sorting equipment

 
  

Orthodyne

The worlds leader of rotary head, ultrasonic wedge wire bonding equipment for the semiconductor, automotive, and industrial market

   

SemiProbe

SemiProbe is a global supplier of manual to automatic probing and testing solutions for microelectronics, MEMS, nanotechnology, chemistry, microfluidics, optoelectronics, photovoltaics and more.

    
Inseto Microelectronic Equipment Division PDF Datasheet (94Kb)

     
 
 
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