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Microelectronics
Equipment Division
The
Microelectronics Division, was Inseto's first product division.
It provides manufacturing equipment and consumables for the
Microelectronic, Photonic and Semiconductor industries.
Equipment
is offered from systems for the inspection of wafers, through
wafer mounting, plasma cleaning & surface preparation,
die and wire bond, bond test (wire pull / bond & die shear
etc.), assembly automation systems, to final inspection.
Full
technical support including process and operation / maintenance
is provided, with extensively trained field personnel and
information databases. Training either at Inseto's training
facility or onsite, can be provided to maximise equipment
productivity and optimise quality of results. |
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| Advanced
Dicing Technologies - A.D.T. |
A
world leader in the development and manufacture of dicing saws,
laser scribing systems & blades used in the dicing of Silicon-based
Semiconductor Wafers and hard materials including Glass, Ceramics,
Ferrites, MEMS and in Package Singulation |
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| Allteq
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After
wire bond inspection systems, for boat or leadframe carried
devices
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| Amadyne |
Flexible
microelectronic pick & place systems, die bonding equipment
and die sorting machines in manual-inline configurations.
Automation systems for Microelectronics assembly processes
including pick & place, dispensing, UV & snap curing,
eutectic soldering, flip chip etc. |
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| Camtek |
Automatic optical inspection (AOI) systems for wafer-level
inspection and analysis of flip chip bumps, cut quality defects
(Kerf) and wafer surface defects |
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| Dage
Group |
Manufacturers of wire bond testing equipment for pull test,
bond shear and die shear, stud pull, fine pitch shear testing
with high accuracy, repeatability and ease of use |
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Eagle
Test |
Mixed Signal ATE Component Test Manufacturer, test capabilities
include analog devices, mixed-signal RF devices, high power
devices with multi-site test capability |
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| Nanoplas |
Nanoplas
produce a range of Plasma Cleaning equipment for damage free
plasma surface preparation & cleaning |
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| Orthodyne |
The worlds leader of rotary head, ultrasonic wedge wire bonding
equipment for the semiconductor, automotive, and industrial
market |
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TPT |
Manufacture
a modern, semi-automatic, bench mounted wire bonders, which
feature 90° vertical wire feed and are convertible between
gold ball & wedge bonding for ribbon or wire |
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Inseto Microelectronic Equipment Division PDF Datasheet (94Kb) |
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