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Microelectronics
Equipment Division
The
Microelectronics Division, was Inseto's first product division.
It provides manufacturing equipment and consumables for the
Microelectronic, Photonic, Nanoelectronic, Solar Cell and
Semiconductor industries. Equipment is offered from systems
for the inspection of wafers, through wafer mounting, scribing
and dicing, plasma cleaning & surface preparation, die
and wire bond, bond test (wire pull / bond & die shear
etc.), assembly automation systems, to final inspection and
test.
Full
technical support including process and operation / maintenance
is provided, with extensively trained field personnel and
information databases. Training either at Inseto's training
facility or onsite, can be provided to maximise equipment
productivity and optimise quality of results |
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| Advanced
Dicing Technologies - A.D.T. |
A
world leader in the development and manufacture of dicing
saws, laser scribing systems & blades used in the dicing
of Silicon-based Semiconductor Wafers and hard materials including
Glass, Ceramics, Ferrites, MEMS and in Package Singulation |
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| Allteq |
After
wire bond inspection systems, for boat or leadframe carried
devices |
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| Amadyne |
Flexible microelectronic pick & place systems, die bonding
equipment and die sorting machines in manual-inline configurations.
Automation systems for Microelectronics assembly processes
including pick & place, dispensing, UV & snap curing,
eutectic soldering, flip chip etc. |
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| Camtek |
Automatic
optical inspection (AOI) systems for wafer-level inspection
and analysis of flip chip bumps, cut quality defects (Kerf)
and wafer surface defects |
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| Dage
Group |
Manufacturers
of wire bond testing equipment for pull test, bond shear and
die shear, stud pull, fine pitch shear testing with high accuracy,
repeatability and ease of use |
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| Eagle
Test |
Mixed Signal ATE Component Test Manufacturer, test capabilities
include analog devices, mixed-signal RF devices, high power
devices with multi-site test capability |
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| Kulicke
& Soffa |
Manufacture modern semi-automatic bench mounted wire bonders,
for gold ball & wedge bonding of ribbon or wire, automatic
gold ball and bump bonders and automatic die bonding and sorting
equipment |
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| Nanoplas |
Nanoplas produce a range of Plasma Cleaning equipment for
damage free plasma surface preparation & cleaning |
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Orthodyne |
The
worlds leader of rotary head, ultrasonic wedge wire bonding
equipment for the semiconductor, automotive, and industrial
market |
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Inseto Microelectronic Equipment Division PDF Datasheet (94Kb) |
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