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Microelectronic
Materials Division
Inseto's
Microelectronics Materials Division provides assembly materials
and machine consumable items for the semiconductor, photonic
and hybrid assembly industries. Products include bonding wire,
bonding ribbon, metal stampings, solder preforms, hermetic
packages, thick and thin film materials (thick film inks),
metalised thin film & DBC ceramics, thermal dissipation
materials, and die / wire bond consumables.
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| Advanced
Dicing Technologies - A.D.T. |
Producers
of high-quality annular dicing blades including Resin-bond Blades,
Nickel-bond Blades and Metal-bond (Sintered) Blades, for dicing
and scribing semiconductor wafers and hard materials |
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| AIT |
Manufacturer
of resistance welding electrodes / thermodes and solder reflow
tips in a comprehensive range of materials for all makes and
models of equipment |
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| ATP
- Applied Thin Film Products |
ATP fabricates thin film circuits on substrates from As-Fired
Alumina to Beryllium to Fused Silica & Silicon, with metalisation
including Tan/TiW/Au to films including Ni, Pd & Ti. |
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| Century
Seals |
Glass
Sealed Hermetic Packages - Standard Bath-Tub, Platform &
Butterfly packages. Power, Miniature, Fibre Optic & Custom
Packages |
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| Craftronics |
A
leader in the manufacture of production consumables, including
rubber & plastic pickup tips, dispensing nozzles, eject
needles, die collets & QA tools etc., for semiconductor,
microelectronic and photonic assembly |
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| DELO |
A range of adhesives for electronics applications, including
silver filled epoxies, flip chip underfills, light activated
epoxies, heat cured glob-tops and light cured acrylics |
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| Koartan |
Thick film polymer inks, pastes & glazes, including silver
based and gold based conductors, dielectrics, resistors, thermistors
& capacitor materials, plug pastes & etchable conductors |
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Plansee
TMS |
Manufacturer
of high thermal conductivity metals and of seal frames for
hermetic packaging, including copper tungsten, silvar, copper
moly, and metal-matrix heat sinks |
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| SPM |
Manufacturers of gold and aluminium bonding wire / ribbon,
solder preforms, clad metal parts and precision metal stampings |
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Inseto Materials Division PDF Datasheet (106Kb) |
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