Microelectronic Assembly Materials From Inseto UK

Microelectronic Materials Division

Inseto's Equipment Division provides manufacturing equipment for the Microelectronic, Photonic, Nanoelectronic, Solar Cell and Semiconductor industries including probing systmes, dicing and scribing machines, die and wire bonders, plasma cleaners, ovens & vacuum soldering systems, material testers for pull & shear testing, microscopes, automatic inspection systems for wafers and high power test systems etc.

Full technical support including process, operation and maintenance is provided, with extensively trained field personnel and information databases. Training either at Inseto's training facility or onsite, can be provided to maximise equipment productivity and optimise quality of results.

ADAVANCED DICING TECHNOLOGIES - A.D.T.
Producers of high-quality annular dicing blades including resin-bond blades, nickel-bond blades and metal-bond (Sintered) blades, for dicing and scribing semiconductor wafers and hard materials
 
A.I.T.
Manufacturer of resistance welding electrodes / thermodes and solder reflow tips in a comprehensive range of materials for all makes and models of equipment
 
A.T.P. - Applied Thin Film Products
ATP fabricates thin film circuits on substrates from As-Fired Alumina to Beryllium to Fused Silica & Silicon, with metalisation including Tan/TiW/Au to films including Ni, Pd & Ti.
 
CENTURY SEALS
Glass sealed hermetic packages - standard bath-tub, platform &bButterfly packages. Power, miniature, fibre optic & custom packages
 
CHELSEA TECHNOLOGY
Chelsea Technology, Inc. is a stocking distributor for metal, ceramic and plastic semiconductor packages & lids
 
CRAFTRONICS
A leader in the manufacture of production consumables, including rubber & plastic pickup tips, dispensing nozzles, eject needles, die collets & QA tools etc., for semiconductor, microelectronic and photonic assembly .
 
DELO
A range of adhesives for electronics applications, including silver filled epoxies, flip chip underfills, light activated epoxies, heat cured glob-tops and light cured acrylics
 
KOARTAN
Thick film polymer inks, pastes & glazes, including silver based and gold based conductors, dielectrics, resistors, thermistors & capacitor materials, plug pastes & etchable conductors
  AlN Thick Film Pastes
  Gold & Silver Thick Film Conductors
  Thick Film Resistors & Thick Film Thermistors
 
KULICKE & SOFFA
High quality gold & copper wire bonding capilllaries and Semitec (hubbed) dicing blades
   
MICRO POINT PRO
High quality bonding tools (formerly K&S Micro-Swiss) including wedges, die collets, TAB bonding tools, pickup tools & industrial nozzles
 
MICROCERTEC
Specialists in the precision-machining of ceramics, Microcertec manufactures insulators, heatsinks, 3D interconnection devices, and metalised substrates from alumina, AlN, quartz, Macor®, silicon carbide and silicon nitride
 
PLANSEE
Manufacturer of high thermal conductivity metals and of seal frames for hermetic packaging, including copper tungsten, silvar, copper moly, and metal-matrix heat sinks
 
S.P.M. Manufacturers of gold and aluminium bonding wire / ribbon, solder preforms, clad metal parts and precision metal stampings
  Bonding Wire & Ribbon
  Solder Preforms
  Precision Metal Stampings
  Package Cover Lid Assemblies
homepage > products > Microelectronic Materials Division

© inseto 2011. All rights reserved

Follow Inseto On Twitter Follow Inseto's BLOG Follow Inseto On LinkedIn Follow Inseto On Facebook