Inseto
Adhesives For Microelectronic Applications
DELO adhesives are used in a vast range of microelectronic applications including glob-top encapsulants, dam / fill materials, flip chip underfill materials, plus light activated and light cured adhesives for encapsulation, sealing and joining.
Detailed below are some examplecs, however if your particular requirement is not listed, please contact us for further information, as it is more than likely that a similar requirement has been solved before.
Application examples (click image or text link below for more detailed information):
 |
Die Attach Adhesives: Reliability is paramount in microelectronic applications, whether the adhesive is used in military or commercial products. Delo’s high-purity, low CTE adhesives provide the perfect combination for use in all applications. |
 |
Encapsulation Glob Top Adhesives:Protecting bare silicon die is done in a variety of ways, by overmoulding in traditional semiconductor packaging, in metal hermetic packages, or by encapsulation on organic substrates. |
Further
Information On DELO Adhesives for Microelectronic Applications: |
|
| Applications | Bonding,
Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Underfill,
Protection Against Vibration, Conductive Electrical Connection,
Underfill, Dam & Fill |
| Industry Segments | Microelectronic
/ Hybrid Assembly, Semiconductor Assembly / Back-end Assembly
etc., Fiber Optics / Photonic Assembly, Microwave Electronics,
OEM Equipment Manufacturers, Precision Components & Assemblies,
PCB Assembly, Electronic Component / Device Assembly, Smart
Cards, Smart Labels, RFID, Automotive Electronics etc. |
| Technical Advice | |
| DELO Website |  |
| Region | Available
from Inseto in the United Kingdom & Ireland |
