With four different models to choose from, each optimized for a specific range of applications, the 7100 Series covers the full spectrum of dicing materials from IC wafers to package singulation and hard material application. The 7100 Series offers the lowest possible cost -of- ownership while providing the most advanced dicing technology.

7100 Series Advantages:

• 2” and 4” spindle dicing systems
• A full range of automatic vision capabilities
• Advanced hardware platform for high reliability and low maintenance
• Heavy Duty, cast-iron base structure for superior precision and accuracy
• Increased yield, throughput and process control
• Unique multi-panel processing capabilities
• Special blade wear forecast algorithm
• User-friendly, Windows XP based Software platform

Model Range Overview

7100 - 2" Vectus Semiautomatic Saw & Scribing System

2", DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.) Optimized for simple, two-channel alignment of thin material applications up to 150 mm x 150 mm with a low unit cost per device, such as:

• Low Cost Semiconductor Devices
• Discrete Surface Mount Devices
• Standard LED Packages
• Thin-film Devices
• LTCC Substrates
  

7100 - 2" ProVectus Semiautomatic Cutting & Scribing System

2", DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable
Optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm, such as:

• Opto-electronic Components
• PCB BGA Panels
• High-brightness LED Packages
• Silicon Wafers
• SAW Filters
• Glass/Silicon Sensors
• MEMS
• PZT
  

7100 - 4" Fortis Semiautomatic Dicing For Thick Materials

4", AC, 1.7 kW, Air-bearing Spindle (30 krpm Max.)
Optimized for single substrate dicing of thick material applications up to 150 mm x 150 mm with a relatively low unit cost per device, such as:

• Ceramic Substrates
• Alumina
• Hybrids
• Thick-film Devices
  

7100 - 4" ProFortis Semiautomatic High Power Dicing For Thick / Hard Materials

4", DC-brushless, 2.5 kW, Air-bearing Spindle, (30 krpm Max.), with closed-loop turntable
Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 200 mm x 200 mm, such as:

• Glass
• DWDM Optical Filters
• Thick Ceramic Substrates