Inseto UK - Dicing Saws / Blades For Semiconductor Wafers, Ceramic Substrates, Glass, MEMS etc.

Advanced Dicing Technologies Ltd (ADT) - Dicing Saws, Scribes & Blades Advanced Dicing Technologies Ltd. (ADT) is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of Silicon-based Semiconductor Wafers and hard materials including Glass, Ceramics, Ferrites, MEMS and in package singulation. ADT offers dicing equipment and accessories, with a variety of capabilities and levels of automation to suit an ever-growing range of customer requirements. Combining dicing equipment and annular dicing blades, they bring their customers a complete range of dicing solutions. ADT also manufacture a wide selection of annular dicing blades for your most challenging applications. Their blade selection is comprised of three product families distinguished by the type of binder: Resin-bond Blades, Nickel-bond Blades and Metal-bond (Sintered) Blades. Dicing / Scribing Equipment & Dicing Blade Overview:

	7100 Series - Semiautomatic Dicing Systems With four different models to choose from, each optimized for a specific range of applications, the 7100 Series covers the full spectrum of dicing materials from IC wafers to package singulation and hard material application. The 7100 Series offers the lowest possible cost -of- ownership while providing the most advanced dicing technology.	Detailed Overview

	7200 Series - Automatic Dicing Saws With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications. The 7200 sereies is available in configurations for dicing / scribing up to 300mm (12") wafers / substrates.	Detailed Overview

	8000 NextStep Series Laser Scribing System The NextStep System of the laser 8000 Series removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually unaffected. The wafer can then be diced using a standard mechanical dicing process.	Detailed Overview

	Peripheral Equipment ADT offer a broad range of peripheral equipment to complement their Dicing Saws including: Wafer Mounting Stations, Tape Curing Systems, Wafer Cleaning Stations, Spindle Coolant Recirculation Systems, In-line DI Water Ionizers, Closed-loop Filtration Equipment & Wafer Frames & Cassettes.	Detailed Overview

	Dicing Blades & Accessories ADT manufacture a wide selection of annular dicing blades and flanges. Their blade selection is comprised of three product families distinguished by the type of binder: Resin-bond Blades, Nickel-bond Blades and Metal-bond (Sintered) Blades.	Detailed Overview

Further Information On ADT:

Applications / Uses	Dicing Semiconductor Wafers and Cutting Hard Materials Cutting Precision Metal Parts Dicing Thin Film Substrates Cutting Ferrites Scribbing & Dicing Ceramic Cutting Glass & Glass Filters Dicing MEMS Package Singulation etc. PCB Assembly Industries Universities Wafer Processing Passive Component Manufacturing Medical Devices Glass Device Processing
Industry Segments	Semiconductor Production Military & Aerospace Telecommunications Medical Electronics Fiber Optics / Photonics Microwave Electronics Microelectronics Power Semiconductor Assembly Semiconductor Back-end Assembly PCB Assembly Industries Universities Passive Component Manufacturing Medical Devices Glass Device Processing
Technical Advice	enquiries@inseto.co.uk
ADT Website



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