The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications, with systems available for up to 300mm (12") substrates / wafers.

7200 Series Advantages:

• Unique Wx3 wafer handling system streamlines wafer flow for greater productivity
• Continuous digital magnification vision System provides optimal magnification for any eye-point
• Special agorithm predicts blade wear rates to reduce height measurement time and increase UPH
• Touch panel display supports a user-friendly graphical interface (GUI)
• Atomized wafer cleaning technology for superior process results
• Dedicated dressing cassette enables automatic blade dressing
• Built-in Inspection tray allows for in-process quality assessment
• Small footprint

Model Range Overview

7200 ProDice - Fully Automatic Semiconductor Wafer Saw

2"-3", DC-brushless, Air-bearing, 1.2 kW, 60 krpm spindle system, optimized for IC applications

7200 MegaDice - Fully Automatic Package Singulation Saw

2"-3" High-torque, DC-brushless, Air-bearing, 2.4 kW, 60 krpm spindle system, optimized for package singulation and IC applications

7200 GigaDice - Fully Automatic High Power Dicing For Thick / Hard Materials

4"-5" High-torque, DC-brushless, Air-bearing, 2.5 kW, 30 krpm spindle system, optimized for automated dicing of hard materials.