ADT - NextStep Scribing Technology
With ever-increasing
transistor density, shrinking metal lines and gate dimensions,
producers are forced to use metals of higher conductivity
such as copper, "low-k" isolation materials such
as "black diamond" and more test pads.
These
new manufacturing standards set a different threshold for
wafer singulation whereby traditional step cut dicing no longer
meets the quality requirements and cost targets for manufacturing.
ADT meets the market challenge with a new, revolutionary type
of laser for wafer scribing
ADT’s
NextStep system removes only non-silicon elements
from the streets leaving the silicon wafer bare and virtually
unaffected. The wafer can then be diced using a standard mechanical
dicing process.
System
Advantages
- Silicon
transparency to the radiation
- No
micro-cracking and no delamination
- One
pass process at 600 mm per second
- Attractive
cost-of-ownership
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