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Amadyne
- Flexible Microelectronics Assembly Systems
Amadyne,
provide equipment for the automation of production processes within
the Microelectronic and Opto-Electronic markets. With over 15 years
experience of industrial automation, they offer a range of standard
products (see FAB, SAM42 & AMAC21 details below), and specialist
automation solutions.
Amadyne's
standard products include the FAB Series of Fast Automatic Bonders,
the SAM42 Semi Automatic Component Handling System and the AMAC21
Semi-Manual Component Handling Systems, for flexible microelectronics
assembly.
Model
Range Overview:
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FAB
(Fast Automatic Bonder) offers improved speed and accuracy
and incorporates the very latest in motion control & software
technology, whilst not compromising on flexibility.
The
system is housed inside a novel cabinet, which incorporates
particulate control filters, system status illuminators and
an exceptional working area that can accommodate up to two
wafers for parallel processing.
System
features include:
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Elegant Graphical User Interface
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Large Working Area
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High Pick & Place Accuracy
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Automatic Dispense Module Change
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Customer Specific Integration
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Single & Multiple Cell Configurations
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Inline Capable |
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Detailed
Overview
&
Datasheet |
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SAM42
is an automatic batch system, which is new concept in pick
and place capable of die and component assembly from wafer,
waffle or reel, in a small (less than 0.6M sq), bench mounted
footprint.
The
SAM42 system is designed for R&D through medium volume
assembly operations and offers exceptional flexibility, using
some of the latest positioning, image processing, electronics
and software technology available. |
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Detailed
Overview
&
Datasheet |
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AMAC
21 is a manual component handling system. With an open and
flexible design for manufacturing micro electronic and micro
systems devices.
The
system incorporates operator controlled, motorised axis for
the pick and place and assembly operations. |
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Detailed
Overview
&
Datasheet
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| Further
Information On Amadyne |
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| Applications
/ Uses |
Hybrid
Assembly
Die
Bonding
Production
Of Microelectronic Devices
Chip-on-Board
Assemblies
Multi-Chip-Modules
Semiconductor
Components
Development
RF
& Microwave Assembly
Power
Hybrid Assembly
Pick
& Place
Module Assembly
Test
Integration
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| Industry
Segments |
Automotive
Aerospace
Military
Telecommunications
Medical
Electronics
Fiber
Optics / Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly
PCB
Assembly Industries
Universities
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| Technical
Advice |
enquiries@inseto.co.uk
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| Amadyne
Website |
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