Click to browse
Click to browse
Click to browse
A.D.T.
Allteq Industries
Amadyne
Camtek
Dage
Dr Tresky
Focused Test
Loadpoint Bearings
Kulicke & Soffa
Orthodyne Electronics
SemiProbe

Microelectronics Equipment Division

Provides assembly, test & inspection equipment for the microelectronic, photonic and semiconductor industries.

       

 

 

| HOME | PRODUCTS | NEWS | CONTACTS | INFO REQUEST | VACANCIES | SEARCH |

 

 
 
 
   

Amadyne - FAB Series Of Fast Automatic Bonders

FAB Fast Automatic Bonder - Click To Go Back

 

PDF Datasheet (2524Kb)

The new fab modules provide the same rich features, ease of use and high flexibility the SAM42 is famous for. In Addition the new machines also provide something repeatedly requested: SPEED!

Fab is a completely new design, regarding software as well as hardware. Some Highlights

  • Massive aluminum die cast base with integrated linear servos and servo driven Z-axis
  • Rugged steel frame
  • Inline capable
  • Wafer sizes up to 12", or 2x8" in parallel
  • Substrates up to 400mm
  • Digital camera system
  • Tool changer
  • Programmable force & pressure
  • Even more simplified fully graphical application programming
  • SQL-database for product and library data
  • Dual core CPU
  • Linux 2.6 operating system

 

The fab modules also offer an extensive list of software and hardware featuers.

 

FAB Graphical User Interface

Graphical User Interface

FAB Dispense Service Module

Dispense Service Module

FAB Process Module

Process Control Menu

 

 

 

Click Here to go back to the previous page or Email Inseto for further information.

     
 
 
    | HOME | SITEMAP | DISCLAIMERS |