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Datasheet (1211Kb)
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The
SAM42 is a new concept in pick and place, which is capable
of die and component assembly from wafer, waffle or reel,
in a small (less than 0.6M sq), bench mounted footprint.
The
SAM42 system is designed for R&D through medium volume
assembly operations and offers exceptional flexibility, using
some of the latest positioning, image processing, electronics
and software technology available.
SAM42
is capable of assembling the widest range of devices, including
Single-Chip, Multi-Chip, COB, Flip Chip, Chip on Chip etc.
Dice ranging from 0,5mm x 0,5mm up to 25mm x 25mm in size
can be handled in all commonly available presentation forms
i.e. Wafer (up to 12"), Waffle Pak, GEL PAK and Tape
Feeder etc. With 16" x 16" SAM42 also offers the
largest working area in its class, whilst being able to incorporate
standard or customized specific component handling.
The
basic system provides 4 computer controlled axes driven by
high precision motors. Together with the image processing
system, SAM42 can achieve placement accuracies up to 25µm
@ 3 sigma.
The
system features:
- Flexible
Pick & Place System
- Windows
based graphical user interface for simple programming &
use
- Large
multi-function work-area 400x400mm
- Pick
up from wafer (up to 300mm)
- Pick
up from tape & reel, waffle pack, gel pack etc.
- Die
flip chip option
- Dispensing,
epoxy writing or epoxy transfer
- Integrated
vision with upward and downward camera options
- CAD
data import for program setup
- Manual
operator driven or fully automatic assembly modes
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