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Microelectronics Equipment Division

Provides assembly, test & inspection equipment for the microelectronic, photonic and semiconductor industries.

       

 

 

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Camtek - Falcon 800 3D Wafer Defect Inspection System

 

Camtek Falcon 800 Metrology Wafer Inspection System

PDF Datasheet (1478Kb)

Camtek has developed the Falcon 800 line of advanced measurement and metrology systems for inspecting bumped wafers and ensuring that bumps meet their tight dimensional tolerances.The CTS – Camtek’s Triangulation System (patent-pending) applies a novel approach to the proven triangulation principle that improves accuracy and repeatability on a variety of bumping technologies. Broader angular coverage creates a stronger and more stable reflection from a wide range of bump shapes and materials, supporting real 3D reconstruction of bump topography.

The Falcon 800 has been specifically designed for measuring even the finest gold bumps. Selected high-grade certified mechanical structure and assemblies provide the stability for micron-level measurement at high speeds.


The combination of the CTS capabilities, optics and specific algorithms enables meeting even the most demanding gold bump applications.

Flip-Chip bumps, including solder, lead- free and copper bumps present a wide variety of shapes and textures, which create high dynamic spectral range and varying reflectivity. The combination of bright field and dark field illumination images these objects with high contrast and details that enable reliable measurement. In addition to CTS, the Falcon 800 can be equipped with CCS – Confocal Chromatic Sensor. This submicron height sensor provides pinpoint precision to verify critical height dimension, or sample gold bump surface roughness or profile.

As a metrology instrument, the Falcon 800 has a set of built-in NIST-certified calibration targets that are always available for ensuring measurement accuracy. A comprehensive suite of SPC charts and reports supports bump defect and dimension analysis by die, wafer, and lot levels.

Performance Highlights

  • Designed for high-speed measurement and analysis of bumped wafers
  • Metrology tools for process contro
  • Validation of bumping conformance to customer specification
  • Enhanced utilization with extensive off-line recipe setup and defect review capabilitie
  • Fast, easy and intuitive setup

 

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