Falcon
500PD is an advanced automatic framed wafer inspection system
for detection and analysis of surface and probe mark defects,
bump size and placement deviations, as well as dicing-related
defects.
Post-dicing
inspection provides the last opportunity to capture, at the
wafer level, defects from all preceding processes. Camtek's
Falcon 500PD line of automatic framed wafer inspection systems
delivers superb detection of surface and probe mark defects,
bump size and placement deviations, as well as dicing-related
defects.
Separated
from each other in dicing, individual die may shift and rotate
relative to their original position in the wafer, getting
out of registration with the reference wafer.
The Falcon 500PD overcomes this problem by virtually aligning
the die in real time during scanning. The optional Quick Exchange
Station increases throughput by speeding the wafer load-unload
cycle.
Extensive
off-line recipe setup and defect review capabilities enhance
system productivity, while the built-in comprehensive SPC
package provides timely statistical analysis to assist in
process control. These advantages combine with Camtek's
renowned detection algorithmics to make the Falcon 500PD
an indispensable tool on the advanced packaging floor.
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High
throughput for 100% inspection at production rates
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Definition
of inspection parameters per specific zones supports
reliable detection of real defects per user preferences.
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Special
algorithms for probe mark inspection detect mark size
deviation, multiple probe marks, proximity to pad edge.
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Bright
field and dark field illumination for better defect
edge definition.
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Advanced
metrology tools and built-in calibration targets turn
the Falcon into a precision measurement instrument.
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Inspection
of defects from processes prior to dicing & Inspection
of Die boundary violation
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