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Dage
- Bond Testing Systems
This
innovative division of The Dage Group has a strong portfolio of
products for destructive and non-destructive mechanical testing
and inspection of electronic components.
With its self-contained
R&D facilities, Dage Electronics Test Systems has developed
world-leading products for testing wire bonds on semiconductor packages
such as BGAs, Chip Scale Packages (CSP) and other electronic components.
Their commitment to continuous development has ensured that products
are brought swiftly to market to support customers in emerging technology
sectors. A philosophy that has most recently led to the development
of products for 300 mm wafer bump shear.
Dage bond testing
products available from Inseto:
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Series
4000 Multi-purpose Bondtester
The
DAGE-SERIES-4000 is a modular Multi-Function Bondtester,
capable of meeting all pull and shear applications. This
system can be configured as a simple wire pull tester, and
upgraded to provide ball shear, die shear or tweezer pull
tests. The 4000 uses the Dage Frictionless Patented Load
Cartridge Systems and Air Bearing technology, to ensure
maximum accuracy, repeatability, and reproducibility.
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Detailed
Overview & Datasheet |
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Series
4000 HS High Speed Bond Tester
Solder ball joint integrity has always been an issue but never
more so than with the introduction of lead-free solder. Until
now qualifying solder joint integrity has been difficult,
unreliable and time consuming. With the 4000HS individual
bonds can be tested immediately after reflow under a range
of consistent speeds and loading conditions providing accurate
performance data on solder joint resistance to brittle fracture. |
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Detailed
Overview & Datasheet |
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Series
4300 Bump Testing System
The
Series 4300 is a new product introduced to meet the growing
demand for handling and bump shear testing on 300mm wafers.
The DAGE-SERIES-4300 has been engineered in accordance with
the strict demands of semiconductor foundries and subcontractors.
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Detailed
Overview & Datasheet |
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Series-5000
Ultra Fine Pitch Bondtester
The
Series 5000 provides unrivalled Levels Of Bondtesting - Down
to 25 Microns. At pitches of less than 35 micron, a new generation
of bondtester is required. The DAGE-SERIES-5000 has been specifically
designed to meet this challenge |
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Detailed
Overview & Datasheet |
Further
Information On Dage Bond Testers |
Applications
/ Uses |
Wire
Bond Testers :-
Validation
Of Process & Machine Setup
In
Process Quality Control
Wire
Bond Strength Analysis
Materials
Testing
Die
Shear & Bond Shear Strength Checks
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Industry
Segments |
Automotive
Aerospace
Military
Telecommunications
Medical
Electronics
Fiber
Optics / Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly
PCB
Assembly Industries
Universities
Medical
Devices
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Technical
Advice |
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Dage
Group Website |
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