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Dage
- Bond Testing Systems
This
innovative division of The Dage Group has a strong portfolio of
products for destructive and non-destructive mechanical testing
and inspection of electronic components.
With
its self-contained R&D facilities, Dage Electronics Test Systems
has developed world-leading products for testing wire bonds on semiconductor
packages such as BGAs, Chip Scale Packages (CSP) and other electronic
components. Their commitment to continuous development has ensured
that products are brought swiftly to market to support customers
in emerging technology sectors. A philosophy that has most recently
led to the development of products for 300 mm wafer bump shear.
Dage bond testing
products available from Inseto:
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Series
4000 Multi-purpose Bondtester
The
DAGE-SERIES-4000 is a modular Multi-Function Bondtester,
capable of meeting all pull and shear applications. This
system can be configured as a simple wire pull tester, and
upgraded to provide ball shear, die shear or tweezer pull
tests. The 4000 uses the Dage Frictionless Patented Load
Cartridge Systems and Air Bearing technology, to ensure
maximum accuracy, repeatability, and reproducibility.
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Overview & Datasheet |
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Series
4000 HS High Speed Bond Tester
Solder
ball joint integrity has always been an issue but never more
so than with the introduction of lead-free solder. Until now
qualifying solder joint integrity has been difficult, unreliable
and time consuming. With the 4000HS individual bonds can be
tested immediately after reflow under a range of consistent
speeds and loading conditions providing accurate performance
data on solder joint resistance to brittle fracture.
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Detailed
Overview & Datasheet |
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Series
4300 Bump Testing System
The
Series 4300 is a new product introduced to meet the growing
demand for handling and bump shear testing on 300mm wafers.
The DAGE-SERIES-4300 has been engineered in accordance with
the strict demands of semiconductor foundries and subcontractors.
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Detailed
Overview & Datasheet |
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Series-5000
Ultra Fine Pitch Bondtester
The
Series 5000 provides unrivalled Levels Of Bondtesting - Down
to 25 Microns. At pitches of less than 35 micron, a new generation
of bondtester is required. The DAGE-SERIES-5000 has been specifically
designed to meet this challenge
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Detailed
Overview & Datasheet |
Further
Information On Dage Bond Testers |
Applications
/ Uses |
Wire
Bond Testers :-
Validation
Of Process & Machine Setup
In
Process Quality Control
Wire
Bond Strength Analysis
Materials
Testing
Die
Shear & Bond Shear Strength Checks
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Industry
Segments |
Automotive
Aerospace
Military
Telecommunications
Medical
Electronics
Fiber
Optics / Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly
PCB
Assembly Industries
Universities
Medical
Devices
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Technical
Advice |
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Dage
Group Website |
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