Dr
Tresky - Pick and Place & Rework Equipment
Since
1980, the Dr. Tresky AG company has been supplying the micro-
and opto- electronics industry with innovative component placers
and die bonders. Over 900 units throughout the world have
been installed to meet critical process and placement requirements.
Our worldwide network of distributors provides the technical
support for our customers.
Dr. Tresky
AG designs and manufacture high quality equipment for : Die
Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic,
Microsystemtechnic, and many more..
New products
also include advanced rework systems, see below for further
details.
| |
| |
M-System1
Tresky's
NEW stand-alone manipulator M-System is an easy to use system
for applications of micro handling and assembly. The force
controlled Z-axis and the fine movement for X, Y & Theta,
in combination with the angled adjustable optics, makes
it an advanced assembly solution.
|
Datasheet |
| |
|
|
|
| |
T-3000/2-M
Excellent
performance, ergonomically designed and high reliability
make the T-3002-M ideal for small to complex production
with exceptional ergonomic controls. A cycle time of approx.
4 sec. (process depending) and various development applications
provides a system capable low to high throughput requirements.
|
Datasheet |
| |
|
|
 |
T-3000/2-FC3
A precise, high quality, versatile die bonder
& component placer with superior ergononomic design and
programmable, high accuracy motorised Z-Drive and bonding
force control.
Excellent performance, ergonomic design and
high reliability make the T-3000-FC3 ideal for small and medium
production and various development applications. The automated
Z-Drive with bond force control, enables a high repeatability
of bond parameters.
| Datasheet |
| |
|
|
| |
R-SYSTEM
600 / 1200
The
Rework System R-System600 and R-System1200 is a stand alone
easy to use system for nearly all SMD Rework applications.
The precise placement supported by a split optic gives the
possibility to rework all common components.
|
Datasheet
|
| |
|
|
 |
T-CHIPEX
1
The
Hybrid Rework System T-Chipex 1 removes all glued dies from
substrate. |
Datasheet |
Further
Information On Dr Tresky Bonders & Rework Equipment |
Applications
/ Uses |
|
Microelectronic
Devices
Chip-on-Board Assemblies
Multi-Chip-Modules
Semiconductor Components
Development
Microelectronic Devices
Bio Medical Assembly
Nanoelectronics
MEMS Device Interconnect
Chip-on-Board Assemblies
Multi-Chip-Modules
Semiconductor Components
Development
|
Industry
Segments |
|
Automotive
Aerospace
Military
Telecommunications
Medical Electronics
Photonics
Solar Cell
Nanoelectronics
Fiber Optics
Microwave Electronics
Microelectronics
Power Semiconductor Assembly
Semiconductor Back-end Assembly
PCB Assembly Industries
Universities
|
|
Technical
Advice |
|
enquiries@inseto.co.uk |
Dr
Tresky Website |
|
|
