Kulicke
& Soffa Wire & Die Bonding Equipment
Kulicke
& Soffa (K&S) are the world leaders for manual and
semi-automatic, bench mounted wire bonders. The KnS gold wire
bonders, copper stud bump / wire & aluminium ultrasonic
bonding systems are very easy to operate and are ideal for
universities, development laboratories through to medium volume
production facilities.
K&S
also produce a range of fully automatic ball bonders for high
speed IC & MCM assembly, flexible large area hybrid markets
and stud bumpers for up to 12" wafers, as well as automatic
die bonding systems. These systems provide higher productivity
and yields, whilst enabling production of the most complex
packages at the lowest cost.
Product
Range Overview:
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Manual
Wire Bonders
Leveraging
nearly four decades of experience in developing manual bonding
systems, K&S continue to innovate, delivering market
leading bench top wire bonding systems for gold ball and
bump bonding, ultrasonic aluminium or gold wedge, for small
wire or ribbon applications.
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Detailed
Overview & Datasheets |
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Automatic
Gold Ball Wire Bonders
A new
level of wire bonding performance. The IConn is built upon
the new Power Series platform, with the most powerful X-Y-Z
motion control system ever designed for assembly equipment,
making it the fastest bonder in its market.
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Detailed
Overview & Datasheets |
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Automatic
Wafer Bumpers
The
new AT Premier™ Stud Bumper from K&S offers many
technological advantages that make it the ideal choice for
a wide range of flip chip product applications. Using
industry-standard modeling, this new generation high-speed
stud bumper is the clear cost-of-ownership leader in comparison
to competitive stud bumping technology.
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Detailed
Overview & Datasheets
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Automatic
Die Bonding Systems
Kulicke
and Soffa introduces iStackPSTM the next generation die bonding
platform for advanced stacked die and high performance BGA
applications. iStackPS delivers industry leading throughput
and best-in-class yields by leveraging unique advances in
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Detailed
Overview & Datasheets
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K&S
Die / Wire Bonding Tools & Hub Dicing Blades
K&S
Micro-Swiss is the worlds leading manufacturer of advanced
bonding tools, including capillaries for a broad range of
applications from standard to ultra fine pitch, wedge tools
for small wire bonding, single point TAB bonding tools,
die attach collets and die bond tools for all major brands
of equipment. K&S
Semitec offers a full range of hub dicing blades for a variety
of advanced material applications.
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Detailed
Overview & Datasheets |
Further
Information On K&S Wire Bonders & Die Bonders
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Applications
/ Uses |
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Microelectronic
Devices
Chip-on-Board Assemblies
Multi-Chip-Modules
Semiconductor Components
Development
Microelectronic Devices
Bio Medical Assembly
Nanoelectronics
MEMS Device Interconnect
Chip-on-Board Assemblies
Multi-Chip-Modules
Semiconductor Components
Development
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Industry
Segments |
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Automotive
Aerospace
Military
Telecommunications
Medical Electronics
Photonics
Solar Cell
Nanoelectronics
Fiber Optics
Microwave Electronics
Microelectronics
Power Semiconductor Assembly
Semiconductor Back-end Assembly
PCB Assembly Industries
Universities
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Technical
Documents |
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Capillary
Central (Online Capillary Catalogue, Design & Process
Resource)
Technical
Library Of K&S Wire Bonding Papers
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Technical
Advice |
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enquiries@inseto.co.uk |
KnS
Website |
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