Kulicke
& Soffa (K&S) Automatic Die Bonders
Kulicke
and Soffa introduces iStackPSTM the next generation die
bonding platform for advanced stacked die and high performance
BGA applications. iStackPS delivers industry leading throughput
and best-in-class yields by leveraging unique advances in
functionality.
K&S
equipment helps to solve assembly challenges in all kind
of markets, such as semiconductor backend, micro system
technology, automotive, mobile telephony, industrial electronics
and many more.
Fully
Automatic Die Bonding Equipment Overview:
| 
PDF
Datasheet (2800Kb)