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Kulicke
& Soffa (K&S) Manual Wire Bonders
For
process development, production or research, K&S Manual
Wire Bonding Systems provide excellent ease of use, optimum
bond quality and repeatability, plus the reliability needed
for the most challenging bonding applications.
Kulicke
& Soffa Ultrasonic Wire bonders are available with Semi-automatic
and manual operation modes, individual bond parameter control
and capacity for a wide range of wire diameters enable ease
of use in gold ball bonding, ball bumping, coining, security
bonding, single-point TAB, thermosonic, aluminium or gold
wedge and ribbon bonding applications.
Manual
Wire Bonding Equipment Overview:
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K&S
4526 Wedge Bonder - Analog Controls
The
4526 K&S manual wedge bonder is simple to set-up and
for ease of use incorporates analog controls, which allow
rapid adjustment of individual bonding parameters. The
system is capable of ultrasonically bonding a wide range
of gold / aluminium wires and ribbons from 12 - 75 micron
wire through 25 x 250micron ribbon.
A
motorised Y axis with auto-stepback provides controlled
wire length and repeatable loop formation. In addition,
the system has a large working area and table motion, with
excellent Z axis clearance, for bonding small through large
devices.
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K&S
4523 Wedge Bonder - Digital Controls
The
4523 is an advanced bench-top bonder with operator initiated,
manual through automatic bonding modes. The system is capable
of ultrasonically bonding a wide range of gold / aluminium
wires and ribbons from 12 - 75 micron wire through 25 x
250micron ribbon.
A
digital interface manages up to 200 programs, with up to
six channels per program. This systems allows quick adjustment
of machine settings and for programs to be stored or recalled
instantly.
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K&S
4522 Ball Bonder - Analog Controls
The
4522 is an advanced bench-top manual gold ball wire bonder
with operator initiated controls and analog adjustments,
which allow rapid adjustment of individual bonding parameters.
The system is capable of ultrasonically bonding gold wires
from 18 - 75 micron.
A
system features a large bonding area up to 6 x 6",
consistent ball size control via negative EFO, missing ball
detection with auto-stop and advanced loop controls.
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 PDF
Datasheet (159Kb)
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K&S
4524 Ball Bonder - Digital Controls
The
4524 is an advanced bench-top gold ball bonder with operator
initiated, manual through automatic bonding modes. The system
is capable of ultrasonically bonding gold wires from 18 -
75 micron.
A
digital interface manages up to 200 programs, with up to six
channels per program. This systems allows quick adjustment
of machine settings and for programs to be stored or recalled
instantly.
A
motorised Y axis with auto-stepback provides controlled wire
length and repeatable loop formation. In addition, the system
has a large working area and table motion, with excellent
Z axis clearance, for bonding small through large devices.
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K&S
4700 Convertible Ball & Wedge Bonder
The 4700 Convertible Wire Bonder allows Ball-Wedge and Wedge-Wedge
Bonding Cycles on ONE Machine! The system is based on the
proven K&S 4500 Series, the market leader for nearly
a decade.
The
4700 features analog dials for ease of use, combining the
best features of the workhorse 4523 and 4524 models. Wedge
or Capillary mounting is easy and precise with a special
transducer, unique to K&S Model 4700. Applications ranging
from the basic type to the most challenging are handled
with ease and with the versatility demanded by today's leading
research or production requirements.
No
tools required for changeover, just swing the EFO assembly
to the proper position and press a switch to select ‘Ball
Bonding' or ‘Wedge Bonding' process.
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