The
AT Premier takes stud bumping productivity to a whole
new plateau enabling applications that were previously
limited to mass solutions. Offering the fastest bumping
speeds in the market along with the smallest footprint,
AT Premier maximizes the use of resources and clean room
space. Stud bumping on the AT Premier platform is flexible
enough for rapid prototyping and scalable for production.
Its
“premier” performance is highlighted by the
following features:
*
Quantum Leap in Bump Speed
* Easy-to-Use & Robust Wafer Mapping
* Low-Impact Force for Bond Control
* Bump Shape Process Flexibility
* Short Product Changeover Time
* Smallest Footprint In The Market
* Step-and-Repeat and Circle Teach Programming
The
AT Premier's unique wafer mapping system helps you reduce
production costs by bonding only known good die.
PDF
Datasheet (392Kb)