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Nanoplas
- Damage Free Plasma Cleaning, Stripping & Etching Systems
Nanoplas manufacture
plasma cleaning and etching systems for damage free surface preparation
& cleaning within the microelectronics, PCB, medical and related
industries. Proprietary technology is applied to front-end manufacturing,
advanced IC packaging and to Wafer Level Packaging applications
addressing the growing demand for low temperature processing.
Nanoplas
patented High Density Radical Flux processing produces very dense
neutral to the sample surface free of ions and electrons. As a result
there is no ion bombardment, no electron nor energetic photons present
inside the process chamber, UV radiation is also completely eliminated.
This results in a Damage Free process and addresses growing demand
for low temperature processing.
The equipment can be characterised as follows:
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Damage free surface preparation at affordable cost.
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Efficiency at low power and low temperature.
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Process optimisation by gas flow control over three gases.
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Products can be stacked due to the down flow of neutrals.
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Equal efficiency through the whole process chamber.
Model
Range Overview:
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DSB3
Versatile Table Top Batch Plasma Cleaning System
The DSB3
is ideally suited for a variety of plasma processes in R&D
or laboratory applications. System is typically used for organic
contamination removal and ultra sensitive surface preparation.
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| DSB-3000
IC Packaging Surface Preparation
Surface
preparation applications including die attach, underfill and
encapsulation/mold. System is equipped with a 300 watts RF
generator and the option of bias module to insure non chemical
reactive material removal. Bias insure full control of the
ion energy. This feature is unique in the market place.
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Detailed
Overview &
Datasheet |
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DSB-6000
Photoresist Stripping and Etching System
System
is equipped with a 600 watts RF generator for photoresist
removal or organic cleans. Very compact it is also suitable
for SiN or SiO2 etching processing. System is used for silicon,
III/V compounds, quartz or ceramic substrates processing,
up to 8”. Automatic wafer loading is available as an
option.
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Overview &
Datasheet |
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Further
Information On Nanoplas |
| Applications
/ Uses |
Cleaning
Surfaces
Surface
Pre-Treatment
Reactive
Electron Microscope SEM Lens & Specimen Cleaning
Hydrocarbon
Contaminant Cleaning
PCB
Etch Back, De smear
Teflon
Activation
Inner
Layer Preparation
Organic
Cleaning
Wire
Bond Pad Cleaning
Photo
Resist Stripping
Descurn
SiO2,
SiN & Metal Films Etching
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| Industry
Segments |
Automotive
Aerospace
Military
Telecommunications
Medical
Electronics
Fiber
Optics / Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly
Medical
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| Nanoplas |
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