 PDF
Datasheet (868Kb)
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With
the introduction of the 3600Plus Large Wire Bonder, Orthodyne
again demonstrates its leading position in the wedge bonder
market. The 3600Plus is a high-speed, high-accuracy wire bonder
designed for power modules, automotive packages and other
large wire MCM applications.
The new 3600Plus represents a new wire bonder platform that
meets today's advanced packaging challenges. Its technology
delivers high productivity, process stability, low cost of
ownership (COO) and the flexibility to grow with the market
demands.
The
system features:
- High
speed, high quality wire bonding
- Windows
based graphical user interface for simple programming &
use
- Quick
change bonding consumables
- High
performance & reliability
- Large
bonding area with integrated safety curtain
- Enhanced
grey scale vision
- Orthodyne
digital ultrasonic system
- Onboard
bond process monitoring & SPC reporting
- Automatic
loop control option
- Front
or rear cut deep access bond heads
- Standalone
or inline configuration
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