| 
 PDF
Datasheet(2200Kb)
|
With
the introduction of the 3700Plus Small Wire Bonder, Orthodyne
again demonstrates its leading position in the fine wedge
wire bonder market. The 3700Plus is a high-speed, high-accuracy
wire bonder specifically designed for small wire hybrid, COB,
and MCM applications.
The
new 3700Plus represents a new wire bonder platform that meets
today's advanced packaging challenges. Its technology delivers
high productivity, process stability, low cost of ownership
(COO) and the flexibility to grow with the market demands.
The
system features:
- High
speed, high quality wire bonding
- Windows
based graphical user interface for simple programming &
use
- High
performance & reliability
- Large
bonding area with integrated safety curtain
- Enhanced
grey scale vision
- Orthodyne
120KHz ultrasonic system
- Onboard
bond process monitoring & SPC reporting
- Repeatable
& programmable tail length control
- Manual
to automatic bonding controls
- Networking
via Ethernet, USB, or Serial port
- Standalone
or inline configuration
|
