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 PDF
Datasheet (39Kb)
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A
bench-mounted semi manual wire bonder for large diameter wire
& ribbon bonding of power devices / components using gold
or aluminium wires.
The
Model 20 is ideal for small to medium size production and
for use on universities or development laboratories.
The
Model 20 can bond wire sizes from 100 to 625 microns in diameter,
with ribbon bonding options:
The
system features:
- Automatic
looping and step-back.
- Deep
access, multiple stitch, and manual Z options.
- Phase-locked
generator maintains power frequency and eliminates manual
re-tuning.
- Transducer
demand control produces perfect bonds regardless of minor
bond site differences.
- Spotlight
targeting available.
- Can
be operated in semiautomatic or manual mode.
- Simple,
high yield use.
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