| Orthodyne
Electronics - Wire Bonding Equipment
For
more than 30 years, Orthodyne Electronics have been the worlds leader
in design, innovation and manufacture of wire bonders for wedge
bonding in the semiconductor, microelectronic, automotive and industrial
markets.
Orthodyne
wire bonders are known for their outstanding reliability and performance
combined with the industries best level of after sales support.
The
Orthodyne product family of wire bonding equipment includes semiautomatic
bench-top wire bonders to fully automatic stand-alone or inline
wire bonders, for ultrasonic bonding both small and large wire diameters
from 17 to 625microns.
Model
Range Overview:
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M20
Semi manual bench-top wire bonder for large diameter wire &
ribbon bonding of power devices / components using gold or aluminium
wires. |
Detailed
Overview & Datasheet |
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3600Plus
Fully automatic advanced stand-alone or inline wire bonder,
for high speed bonding of small to large area devices using
large diameter wires (100 to 500 microns). |
Detailed
Overview & Datasheet
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3700Plus
Fully automatic advanced stand-alone or inline fine wire bonder,
for high speed bonding of small to large area devices using
small diameter wires (17 to 75 microns). |
Detailed
Overview & Datasheet |
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Further
Information On Orthodyne |
| Applications
/ Uses |
Aluminium
& Gold Wedge Wire Bonding Of:
Microelectronic
Devices
Chip-on-Board
Assemblies
Power
Hybrid Modules
Semiconductor
Components
Multi-chip-Modules
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| Industry
Segments |
Automotive
Aerospace
Military
Telecommunications
Medical
Electronics
Fiber
Optics / Photonic Assembly
Microwave
Electronics
Microelectronics
Power
Semiconductor Assembly
Semiconductor
Back-end Assembly
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| Technical
Papers |
 Design
Considerations for Wire Bonding Power Hybrids (332Kb)
Heavy
Al Ribbon Interconnect: An Alternative Solution for Hybrid
Power Packaging (555Kb)
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| Technical
Advice |
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| Orthodyne
Website |
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